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Pac Tech - Packaging Technologies Gmbh

USPTO Granted Patents = 59

% Expired Patents = 5.1

EPO Patents = 27

Trademarks = 5

Forward Citations = 355

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29 inventors (with patents filed for the assignee):

Ghassem Azdasht (35 out of 53 patents)

Elke Zakel (19 out of 45 patents)

Matthias Fettke (10 out of 11 patents)

4. Andrej Kolbasow (9 out of 9 patents)

5. Paul Kasulke (7 out of 15 patents)

6. Thorsten Krause (6 out of 6 patents)

7. Thorsten Teutsch (4 out of 4 patents)

8. Siavash Hosseinpour Tabrizi (3 out of 3 patents)

9. Hans-Hermann Oppermann (2 out of 18 patents)

10. Jan Hoffmann (2 out of 2 patents)

11. Lars Titerle (2 out of 5 patents)

12. Kaveh Momeni (2 out of 2 patents)

13. Nico Lange (2 out of 2 patents)

14. Andreas Ostmann (1 out of 13 patents)

15. Martin Lange (1 out of 18 patents)

59 patents: Sort by Forward Citations

1. 12693311 - Device for handling a test contact (2026-07-28),

2. 12678881 - Laser-assisted soldering apparatus and solder deposition machine (2026-07-14),

3. 12643167 - Press-forming device for depositing solder and producing individual solder bodies (2026-06-02),

4. 12485500 - Method for monitoring a laser soldering process, and laser soldering system using a spectroscope device (2025-12-02),

5. 12358084 - Bonding head and bonding apparatus (2025-07-15),

6. 12349287 - Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole (2025-07-01),

7. 12171066 - Method for removing and repositioning electronic components connected to a circuit board (2024-12-17),

8. 12048972 - Method and device including laser heating of gripper for repairing a test contact arrangement (2024-07-30),

9. 12028987 - Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole (2024-07-02),

10. 12023756 - Method for removing electronic components connected to a circuit board (2024-07-02),

11. 11618094 - Solder ball feeding device (2023-04-04),

12. 11554434 - Method and laser arrangement for fusing a solder material deposit by means of laser energy (2023-01-17),

13. 11367709 - Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement (2022-06-21),

14. 11224928 - Device for the separate application of solder material deposits (2022-01-18),

15. 11217558 - Method and device for establishing a wire connection as well as a component arrangement having a wire connection (2022-01-04),

Pac Tech - Packaging Technologies GmbH specializes in advanced packaging solutions for the semiconductor industry. With a focus on innovative technologies, the company offers a range of products including wafer-level packaging, flip-chip bonding, and advanced interconnect solutions. Their expertise ensures high-quality, reliable packaging that meets the demands of modern electronics. Pac Tech is committed to sustainability and efficiency, providing tailored solutions that enhance performance while minimizing environmental impact.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Sep 15 2026

Pac Tech - Packaging Technologies Gmbh

59 Patents

#1 in 14641 Nauen

#927 in Germany

#12,205 in the World

Pac Tech - Packaging Technologies Gmbh

Forward Citations = 355

29 inventors:

Ghassem Azdasht (35 out of 53 patents)

Elke Zakel (19 out of 45 patents)

Matthias Fettke (10 out of 11 patents)

4. Andrej Kolbasow (9 out of 9 patents)

5. Paul Kasulke (7 out of 15 patents)

Please report any incorrect information to [email protected]

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