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Pac Tech - Packaging Technologies Gmbh

USPTO Granted Patents = 60

% Expired Patents = 5.0

EPO Patents = 27

Trademarks = 5

Forward Citations = 355

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29 inventors (with patents filed for the assignee):

Ghassem Azdasht (35 out of 53 patents)

Elke Zakel (19 out of 45 patents)

Matthias Fettke (11 out of 12 patents)

4. Andrej Kolbasow (10 out of 10 patents)

5. Thorsten Krause (7 out of 7 patents)

6. Paul Kasulke (7 out of 15 patents)

7. Thorsten Teutsch (4 out of 4 patents)

8. Siavash Hosseinpour Tabrizi (3 out of 3 patents)

9. Hans-Hermann Oppermann (2 out of 18 patents)

10. Jan Hoffmann (2 out of 2 patents)

11. Lars Titerle (2 out of 5 patents)

12. Kaveh Momeni (2 out of 2 patents)

13. Nico Lange (2 out of 2 patents)

14. Svetlana Milz (2 out of 2 patents)

15. Andreas Ostmann (1 out of 13 patents)

Core Competencies:

Laser Soldering

Solder Ball Application

Electronic Component Bonding

Solder Material Deposits

Chip Module Production

Test Contact Arrangement

Thermal Bonding

Semiconductor Chip Assembly

Contact Structures

Soldering Process Monitoring

Repairing Soldered Joints

Wire Connection Establishment

60 patents: Sort by Forward Citations

1. 12752380 - Bonding head and bonding apparatus (2026-10-06),

2. 12693311 - Device for handling a test contact (2026-07-28),

3. 12678881 - Laser-assisted soldering apparatus and solder deposition machine (2026-07-14),

4. 12643167 - Press-forming device for depositing solder and producing individual solder bodies (2026-06-02),

5. 12485500 - Method for monitoring a laser soldering process, and laser soldering system using a spectroscope device (2025-12-02),

6. 12358084 - Bonding head and bonding apparatus (2025-07-15),

7. 12349287 - Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole (2025-07-01),

8. 12171066 - Method for removing and repositioning electronic components connected to a circuit board (2024-12-17),

9. 12048972 - Method and device including laser heating of gripper for repairing a test contact arrangement (2024-07-30),

10. 12028987 - Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole (2024-07-02),

11. 12023756 - Method for removing electronic components connected to a circuit board (2024-07-02),

12. 11618094 - Solder ball feeding device (2023-04-04),

13. 11554434 - Method and laser arrangement for fusing a solder material deposit by means of laser energy (2023-01-17),

14. 11367709 - Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement (2022-06-21),

15. 11224928 - Device for the separate application of solder material deposits (2022-01-18),

Company Overview

Pac Tech - Packaging Technologies GmbH, based in Nauen, Germany, specializes in advanced soldering technologies tailored for the electronics industry. The company focuses on innovative solutions such as laser soldering, solder ball application, and electronic component bonding, which are essential for modern semiconductor chip assembly and production. Their expertise extends to thermal bonding and the arrangement of test contacts, positioning them as a key player in enhancing the efficiency and reliability of electronic packaging processes.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

60 Patents

#1 in 14641 Nauen

#922 in Germany

#12,077 in the World

Pac Tech - Packaging Technologies Gmbh

Forward Citations = 355

29 inventors:

Ghassem Azdasht (35 out of 53 patents)

Elke Zakel (19 out of 45 patents)

Matthias Fettke (11 out of 12 patents)

4. Andrej Kolbasow (10 out of 10 patents)

5. Thorsten Krause (7 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Pac Tech - Packaging Technologies Gmbh. Retrieved from https://idiyas.com/company/pac-tech-packaging-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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