Berlin, Germany

Matthias Fettke

USPTO Granted Patents = 9 

 

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2013-2025

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9 patents (USPTO):Explore Patents

Title: The Innovative Journey of Matthias Fettke

Introduction

Matthias Fettke, an accomplished inventor based in Berlin, Germany, has made significant contributions to the fields of electronics and engineering. With a total of 8 patents to his name, his work showcases a blend of ingenuity and practical application in modern technology.

Latest Patents

Among his notable inventions are the "Bonding Head and Bonding Apparatus" and a "Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder." The bonding head invention features a sophisticated design that includes a laser source, a vacuum source, and a holding nozzle, allowing for precise soldering of substrates. The laser duct within the apparatus enables the directed use of the laser beam to efficiently manipulate solder. His second recent innovation revolutionizes the soldering process by utilizing a liquefied solder ball jetted into a through hole on a circuit board, ensuring an effective and clean attachment of electronic components.

Career Highlights

Fettke's career has been marked by his dedication to advancing technology. He has worked with renowned companies such as Pac Tech—Packaging Technologies GmbH and Fraunhofer Gesellschaft zur Förderung der Angewandten Forschung e.V. His experience in these high-tech environments has played a crucial role in shaping his innovative mindset and technical skills.

Collaborations

Throughout his professional journey, Matthias Fettke has collaborated with talented individuals like Andrej Kolbasow and Nico Lange. These partnerships have enhanced his ability to bring innovative ideas to fruition, illustrating the power of teamwork in the realm of invention.

Conclusion

Matthias Fettke stands out as a remarkable inventor whose work continues to influence advancements in electronic assembly and soldering techniques. With his range of patents and collaborative spirit, he exemplifies the essence of innovation, paving the way for future breakthroughs in technology.

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