The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Aug. 29, 2022
Pac Tech—packaging Technologies Gmbh, Nauen, DE;
Andrej Kolbasow, Paulinenaue, DE;
Matthias Fettke, Berlin, DE;
Pac Tech—Packaging Technologies GmbH, Nauen, DE;
Abstract
A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.