The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2024

Filed:

Oct. 21, 2021
Applicant:

Pac Tech—packaging Technologies Gmbh, Nauen, DE;

Inventors:

Matthias Fettke, Berlin, DE;

Andrej Kolbasow, Paulinenaue, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 26/03 (2006.01); B23K 101/42 (2006.01); B25J 15/04 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0486 (2013.01); B23K 1/0016 (2013.01); B23K 3/08 (2013.01); B23K 26/034 (2013.01); B25J 15/04 (2013.01); H05K 13/0409 (2018.08); H05K 13/0812 (2018.08); H05K 13/082 (2018.08); B23K 2101/42 (2018.08);
Abstract

A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.


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