The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Mar. 15, 2018
Applicant:

Pac Tech—packaging Technologies Gmbh, Nauen, DE;

Inventors:

Andrej Kolbasow, Karstädt OT Nebelin, DE;

Jan Hoffmann, Michendorf, DE;

Matthias Fettke, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/005 (2006.01); B23K 3/06 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); B23K 1/0056 (2013.01); B23K 3/0623 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); B23K 2101/38 (2018.08); H01L 2224/48465 (2013.01); H01L 2224/7855 (2013.01); H01L 2224/78263 (2013.01); H01L 2224/78611 (2013.01); H01L 2224/85214 (2013.01); H01L 2224/85815 (2013.01);
Abstract

A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.


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