Kaveh Momeni

Title: Kaveh Momeni: Innovator in Soldering Technology

Introduction

Kaveh Momeni is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of soldering technology, holding two patents that showcase his innovative approach to thermal bonding and solder placement.

Latest Patents

Momeni's latest patents include a "Method and device for placing and remelting shaped pieces consisting of solder material." This invention involves a method and device designed to place multiple shaped parts of solder material on a bond pad arrangement of a substrate. The process includes the use of a template device with numerous apertures to accommodate the solder parts, followed by the application of laser energy to remelt these parts onto the bond pads.

Another significant patent is the "Method and device for thermally bonding connecting surfaces of two substrates." This method focuses on the thermal connection of overlapping surfaces of two substrates, with at least one being transparent. Laser energy is applied from the rear side of the transparent substrate to each contact pair constructed between the connecting surfaces of the opposing substrates.

Career Highlights

Kaveh Momeni works at Pac Tech Packaging Technologies GmbH, where he continues to develop innovative solutions in the field of packaging technologies. His work emphasizes the importance of precision and efficiency in soldering applications.

Collaborations

Momeni collaborates with Ghassem Azdasht, contributing to advancements in their shared field of expertise.

Conclusion

Kaveh Momeni's contributions to soldering technology through his patents reflect his commitment to innovation and excellence. His work at Pac Tech Packaging Technologies GmbH positions him as a key figure in the industry.