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For the Inventor, By the Inventor

Falkensee, Germany

Elke Zakel

USPTO Granted Patents = 45 

 

Average Co-Inventor Count = 2.6

ph-index = 8

Forward Citations = 483(Granted Patents)


Location History:

  • 14612 Falkensee, DE (1999 - 2000)
  • Berlin, DE (1990 - 2001)
  • Falkenssee, DE (2005)
  • Nauen, DE (2010 - 2014)
  • Falkensee, DE (1998 - 2016)

Company Filing History:

goldMedal19 out of 55 
 
Pac Tech - Packaging Technologies Gmbh
 patents
silverMedal18 out of 4,814 
 
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.
 patents
bronzeMedal4 out of 8 
 
Smart Pac Gmbh Technology Services
 patents
4. 3 out of 3 
 
Pac Tec - Packaging Technologies Gmbh
 patents
5. 1 out of 1,384 
 
Schering Aktiengesellschaft
 patents
6. 4 out of 832,843 
Other
 patents
where one patent can have more than one assignee

Years Active: 1990-2016

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Areas of Expertise:
Chip Transfer
Diode Array
Optical Elements
Circuit Substrates
Solder Deposit
Contact Bump Construction
Flexible Substrate Bonding
Metallization Techniques
Chip Testing
Flip Chip Technology
Thermal Connecting Structures
High Temperature Metal Layers
45 patents (USPTO):Explore Patents
1. 9401298 - Method and device for transferring a chip to a contact substrate (2016-07-26),
2. 8742571 - Diode array and method for producing a diode array (2014-06-03),
3. 8497578 - Terminal face contact structure and method of making same (2013-07-30),
4. 8431477 - Method for joining aligned discrete optical elements (2013-04-30),
5. 8361881 - Method for alternately contacting two wafers (2013-01-29),
6. 8256131 - Method and device for drying circuit substrates (2012-09-04),
7. 7932611 - Device for alternately contacting two wafers (2011-04-26),
8. 7926699 - Method and device for transferring a solder deposit configuration (2011-04-19),
9. 7882997 - Method and device for mutual contacting of two wafers (2011-02-08),
10. 7829817 - Device for removing solder material from a soldered joint (2010-11-09),
11. 7762446 - Method and device for transferring a solder deposit configuration (2010-07-27),
12. 7481352 - Method for ablating points of contact (debumping) (2009-01-27),
13. 7121449 - Method and device for applying material to a workpiece (2006-10-17),
14. 7087442 - Process for the formation of a spatial chip arrangement and spatial chip arrangement (2006-08-08),
15. 7049213 - Method for producing a contact substrate and corresponding contact substrate (2006-05-23),

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