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Falkensee, Germany

Elke Zakel

This inventor holds 45 USPTO granted patents and 1 published patent application and 7 EPO patents, primarily in Chip Bonding Technology. Top assignees: Pac Tech - Packaging Technologies Gmbh, Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Smart Pac Gmbh Technology Services. Active years: 1990-2016.

USPTO Granted Patents = 45 (Patent Applications = 1)

% Patents Active = 91.1

EPO Patents = 7 (Patent Applications = 1)

Average Co-Inventor Count = 2.6

ph-index = 8

Forward Citations = 483(Granted Patents)

Location History:

14612 Falkensee, DE (1999 - 2000)
Berlin, DE (1990 - 2001)
Falkenssee, DE (2005)
Nauen, DE (2010 - 2014)
Falkensee, DE (1998 - 2016)

Company Filing History:

Pac Tech - Packaging Technologies Gmbh

18 out of 4,920

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Smart Pac Gmbh Technology Services

Pac Tec - Packaging Technologies Gmbh

5. 1 out of 1,409

Schering Aktiengesellschaft

6. 4 out of 834,411

Other

patents

where one patent can have more than one assignee

Years Active: 1990-2016

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Areas of Expertise:

Chip Bonding

Soldering Methods

Substrate Arrangements

Diode Arrays

Contact Structures

Optical Elements

Metallization Techniques

Flexible Substrates

Chip Housing

Testing Chips

Thermal Connections

Electronic Components

45 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9401298 - Method and device for transferring a chip to a contact substrate (2016-07-26),

2. 8742571 - Diode array and method for producing a diode array (2014-06-03),

3. 8497578 - Terminal face contact structure and method of making same (2013-07-30),

4. 8431477 - Method for joining aligned discrete optical elements (2013-04-30),

5. 8361881 - Method for alternately contacting two wafers (2013-01-29),

6. 8256131 - Method and device for drying circuit substrates (2012-09-04),

7. 7932611 - Device for alternately contacting two wafers (2011-04-26),

8. 7926699 - Method and device for transferring a solder deposit configuration (2011-04-19),

9. 7882997 - Method and device for mutual contacting of two wafers (2011-02-08),

10. 7829817 - Device for removing solder material from a soldered joint (2010-11-09),

11. 7762446 - Method and device for transferring a solder deposit configuration (2010-07-27),

12. 7481352 - Method for ablating points of contact (debumping) (2009-01-27),

13. 7121449 - Method and device for applying material to a workpiece (2006-10-17),

14. 7087442 - Process for the formation of a spatial chip arrangement and spatial chip arrangement (2006-08-08),

15. 7049213 - Method for producing a contact substrate and corresponding contact substrate (2006-05-23),

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