The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Sep. 24, 2001
Applicants:
Hans-hermann Oppermann, Berlin, DE;
Elke Zakel, Falkensee, DE;
Ghassem Azdasht, Berlin, DE;
Paul Kasulke, Berlin, DE;
Inventors:
Hans-Hermann Oppermann, Berlin, DE;
Elke Zakel, Falkensee, DE;
Ghassem Azdasht, Berlin, DE;
Paul Kasulke, Berlin, DE;
Assignee:
Pac Tech-Packaging Technologies GmbH, Nauen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01); H01L 21/66 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
Process for the formation of a spatial chip arrangement having several chips () arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces () to assigned conducting paths () of a conducting-path structure () arranged on at least one carrier substrate () by the chips being arranged transverse to the longitudinal extent of the carrier substrate.