The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
May. 22, 2002
Elke Zakel, Falkensee, DE;
Ghassem Azdasht, Berlin, DE;
Elke Zakel, Falkensee, DE;
Ghassem Azdasht, Berlin, DE;
Pac Tech-Packaging Technologies GmbH, Nauen, DE;
Smart Pac GmbH Technology Services, Nauen, DE;
Abstract
The invention relates to a method for producing a contact substrate () as well as to a contact substrate with through-plating between a connector arrangement () arranged at the top of a dielectric carrier substrate () and the underside of the carrier substrate, wherein the connector arrangement extends along an aperture margin () of a substrate recess (), and the underside () of the carrier substrate () is supported by a backstop (), wherein a formed solder material part () is placed in the substrate recess (), and in a subsequent method-related step said formed solder material part () is deformed within the substrate recess so as to form a formed contact part (), such that radial displacement of the material of the formed solder material part in the substrate recess results in a non-positive connection between an intrados surface () of the substrate recess and the connector arrangement (), and that the formed contact part provides through-plating between the connector arrangement () and the underside () of the carrier substrate.