Pac Tech Packaging Technologies G.m.b.h.

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Other

Smart Pac Gmbh Technology Services

Pac Tec - Packaging Technologies Gmbh

Schering Aktiengesellschaft

Elke Zakel

Ghassem Azdasht

Paul Kasulke

Rolf Aschenbrenner

Hans-Hermann Oppermann

Andreas Ostmann

Lars Titerle

Joachim Eldring

Oliver Uebel

Herbert Reichl

Frank Ansorge

Thorsten Teutsch

Stefan Weiss

Jorg Gwiasda

Lothar Dietrich

Jens Nave

Achim Kloeser

Hans Hermann Oppermann

Matthias Fettke

Erik Beckert

Christine Kallmayer

Joachim Kloeser

Siavash Hosseinpour Tabrizi

Gerald Motulla

Klaus Majentny

Hermann-Josef Middeke

Habib Badrihafifekr

Henrik Banse

David Lin

A method and device for transferring a chip () situated on a transfer substrate () to a contact substrate (), and for contacting the chip with the contact substrate, in which the chip, the back side () of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts () thereof that are arranged opposite a contact surface () of the contact substrate are brought into contact with substrate contacts () arranged on the contact surface by means of a pressing device () from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.

Method and device for transferring a chip to a contact substrate

A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.

Diode array and method for producing a diode array

The invention relates to a contact structure () and to a method for producing a contact structure for semiconductor substrates () or the like, in particular for terminal faces of semiconductor substrates, comprising a base contact part () arranged on a terminal face () of the semiconductor substrate and at least one connecting contact part () arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material () which has a lower melting point than a base contact material of the base contact part.

Terminal face contact structure and method of making same

A method for joining aligned discrete optical elements by which the optical elements can be joined in the aligned state. A thermal connection having long-term stability can be produced at little expense and with high positioning accuracy. Surface regions to be joined can be provided with at least one thin metallic layer by the method for joining aligned discrete optical elements. The surface regions are subsequently wetted using a liquid solder free of flux in a contactless dosed manner. The solder is applied to the surface regions to be joined via a nozzle using a pressurized gas stream.

Method for joining aligned discrete optical elements

A method and device for alternatively contacting two wafer-like component composite arrangements, in which two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metallizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement, so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.

Method for alternately contacting two wafers

Method and device for drying circuit substrates (), in particular semiconductor substrates, in which a circuit surface () of the circuit substrate is flushed using a flushing liquid () in a flushing step and the circuit surface is dried in a subsequent drying step, the circuit substrate being moved in the flushing step in the direction of its planar extension transversely and in relation to a liquid level () of the flushing liquid in such a way that a liquid meniscus forms at a transition area between the circuit surface and the liquid level, which changes because of the relative movement, and thermal radiation () is applied to the transition area wetted by the liquid meniscus in the drying step.

Method and device for drying circuit substrates

A method and device for alternately contacting two wafer-like component composite arrangements, in which the two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metallizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement , so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.

Device for alternately contacting two wafers

Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate () using a removal of multiple solder deposits from a solder deposit reservoir () accommodated in a solder deposit receptacle unit () via an isolation unit (), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings () of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir () being ventilated via a floor wall () situated diametrically opposite the isolation unit during the partial vacuum impingement () by the isolation unit ().

Method and device for transferring a solder deposit configuration

A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer () with a functional component wafer (), to produce electronic assemblies on the wafer level, in which the component composite configurations are each situated on a receptacle unit () and the contact pressure necessary for the contacting between contact metallizations of the component composite configurations to be connected to one another is generated in such a way that a vacuum is generated in a contact chamber which receives the component composite configurations and is delimited by the receptacle units, and the contacting of the contact metallizations is performed by a rear energy impingement of a component composite configuration.

Method and device for mutual contacting of two wafers

In a basic variant of a soldering device whereby a laser device is used for melting solder material (), a protective device is provided which protects the laser lens system () from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel () into an outlet channel () and/or by a diaphragm () arranged in front of the laser lens system.

Device for removing solder material from a soldered joint

The invention relates to a method for removing a plurality of raised places of contact made of a meltable metal, such as tin or indium or an alloy, such as tin-containing solder, silver-containing solder or lead-containing solder, the meltable metal being meltable above a first temperature limit, the places of contact being surface-distributed over a substrate. It is also possible to form vaulted domes on a plurality of metallic support segments which are located on one of the surfaces of a substrate. The invention aims at reducing production costs, particularly at removing a soldered layer once applied. If defective contact places occur, a plurality of the raised contact places, particularly substantially all contacts, are at least in substantial portions melted off from the substrate by contacting them with a molten metal. Between the substrate and the support segments distributed over the substrate and a surface of the molten metal an organic fluid may be present, the organic fluid being provided as a covering layer only and evaporating off the substrate surface, after the vaulted domes have been formed.

Method for ablating points of contact (debumping)

In order to apply solder material () to a workpiece (), compressed gas is guided through a bore hole () of a capillary (). A pressure sensor () situated in the bore hole () measures the dynamic pressure of the compressed gas. As soon as the tip () of the capillary approaches the workpiece (), the dynamic pressure increases and is used as a measure for the distance between the tip () of the capillary () and the workpiece (), enabling the feed motion of the capillary to be controlled.

Method and device for applying material to a workpiece

Process for the formation of a spatial chip arrangement having several chips () arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces () to assigned conducting paths () of a conducting-path structure () arranged on at least one carrier substrate () by the chips being arranged transverse to the longitudinal extent of the carrier substrate.

Process for the formation of a spatial chip arrangement and spatial chip arrangement

The invention relates to a method for producing a contact substrate () as well as to a contact substrate with through-plating between a connector arrangement () arranged at the top of a dielectric carrier substrate () and the underside of the carrier substrate, wherein the connector arrangement extends along an aperture margin () of a substrate recess (), and the underside () of the carrier substrate () is supported by a backstop (), wherein a formed solder material part () is placed in the substrate recess (), and in a subsequent method-related step said formed solder material part () is deformed within the substrate recess so as to form a formed contact part (), such that radial displacement of the material of the formed solder material part in the substrate recess results in a non-positive connection between an intrados surface () of the substrate recess and the connector arrangement (), and that the formed contact part provides through-plating between the connector arrangement () and the underside () of the carrier substrate.

Growing community of inventors

Falkensee, Germany

Elke Zakel