The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Apr. 10, 2006
Applicants:

Elke Zakel, Falkensee, DE;

Ghassem Azdasht, Berlin, DE;

Inventors:

Elke Zakel, Falkensee, DE;

Ghassem Azdasht, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/6836 (2013.01); H01L 24/31 (2013.01); H01L 24/75 (2013.01); H01L 24/86 (2013.01); H01L 24/83 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/16 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/75 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/75314 (2013.01); H01L 2224/7965 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/19043 (2013.01);
Abstract

A method and device for transferring a chip () situated on a transfer substrate () to a contact substrate (), and for contacting the chip with the contact substrate, in which the chip, the back side () of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts () thereof that are arranged opposite a contact surface () of the contact substrate are brought into contact with substrate contacts () arranged on the contact surface by means of a pressing device () from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.


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