The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Jan. 24, 2008
Applicant:

Ghassem Azdasht, Berlin, DE;

Inventor:

Ghassem Azdasht, Berlin, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 9/16 (2006.01); B23K 31/00 (2006.01); B23K 1/005 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0056 (2013.01); B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); H05K 3/3442 (2013.01); H05K 3/3478 (2013.01); H05K 3/3494 (2013.01); B23K 2201/40 (2013.01); H05K 2201/10727 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/041 (2013.01); H05K 2203/082 (2013.01); H05K 2203/107 (2013.01); Y02P 70/613 (2015.11);
Abstract

The invention relates to a method and a device for contacting a solder ball formation, in which a plurality of contact mouthpieces arranged in a formation is used to pick up a solder ball formation with a composition reflecting the relative arrangement of the contact mouthpieces from a solder ball reservoir comprising a multitude of randomly distributed solder balls, the solder ball formation is placed on contact points by means of the contact mouthpieces for subsequently contacting, and subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points.


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