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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10118240 B1

PDFFull Text
Date of Patent:
Nov. 06, 2018

Filed:

Jul. 24, 2017

Method for forming solder deposits

Applicant:

Pac Tech—packaging Technologies Gmbh, Nauen, DE;

Inventor:

Ghassem Azdasht, Berlin, DE;

Assignee:

PAC TECH—PACKAGING TECHNOLOGIES GMBH, Nauen, DE;

Attorney:

Quarles & Brady LLP

Primary Examiner:

Michael G Hoang

Int. Cl.
CPC ...
B23K 26/00 (2014.01); H01L 21/00 (2006.01); B23K 1/20 (2006.01); B23K 1/005 (2006.01); B23K 3/06 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); B23K 1/0056 (2013.01); B23K 3/06 (2013.01); B23K 3/0607 (2013.01); H01L 21/6835 (2013.01); H01L 24/11 (2013.01); H01L 24/742 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/11003 (2013.01); H01L 2224/11822 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/7515 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

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