The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Jan. 30, 2012
Applicant:

Ghassem Azdasht, Berlin, DE;

Inventor:

Ghassem Azdasht, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/005 (2006.01); B23K 26/02 (2014.01); B23K 35/362 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0056 (2013.01); B23K 26/02 (2013.01); B23K 35/362 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/16 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16221 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/81065 (2013.01); H01L 2224/8191 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/81986 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A method for electrically contacting terminal faces of two substrates, such as a chip and a carrier substrate, includes two successive phases. In a first phase, the chip is positioned with its terminal faces against terminal faces of the substrate and laser energy is applied to the chip at the rear. In a second phase, a flux medium is applied and laser energy is applied to the rear of the chip to cause reflow. The device for performing the second phase of the method comprises a carrier table and a housing, which form a housing interior with a top side of the carrier table which receives the component arrangement, and a laser light source, which is oriented so that the laser radiation impinges on the rear side of the first substrate.


Find Patent Forward Citations

Loading…