Pac Tech Packaging Technologies G.m.b.h.

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Smart Pac Gmbh Technology Services

Other

Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Azdasht, Ghassem

Ghassem Azdasht

Elke Zakel

Hans-Hermann Oppermann

Paul Kasulke

Martin Lange

Rolf Aschenbrenner

Mohammad Akhavain

Herbert Reichl

Thorsten Krause

Thorsten Teutsch

Siavash Hosseinpour Tabrizi

Andreas Ostmann

Lars Titerle

Stefan Weiss

Kaveh Momeni

Gerald Motulla

Clemens Ruthnick

Ramin Azadeh

Habib Badrihafifekr

Ricardo Geelhaar

Siavash Tabrizi

The invention relates to a solder ball feeding device, comprising a solder ball reservoir for receiving an amount of solder balls and a metering device for dispensing a metered feeding amount of solder balls to a discharge device, wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection which serves to introduce a pressurized gas into the solder ball feeding device.

Solder ball feeding device

The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device () and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device () and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.

Method and laser arrangement for fusing a solder material deposit by means of laser energy

The invention relates to a device () for the separate application of solder material deposits (), in particular solder balls, comprising a conveying device () for separately conveying the solder material deposits from a solder material reservoir () toward an application device (), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position Pin which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle () of the application device into an application position Pwherein a detector device () is provided that serves to trigger a treatment of the solder material deposit arranged in the application position Pwith laser radiation emitted by a laser device, wherein the detector device has a reflection sensor () that detects reflection radiation () that is reflected by the solder material deposit arranged in the application position P

Device for the separate application of solder material deposits

A device for the application of solder material deposits includes a conveying device for conveying solder material deposits from a reservoir at an upper housing part toward an application device at a lower housing part. The conveying device can be moved from a receiving position Pto a transfer position P, in which the solder material deposit is exposed to a pressure gas via a pressure bore formed in the upper housing part and from which the solder material deposit is transferred to an application nozzle in an application position P. The application device includes an application duct formed in the lower housing and forms a lower section of a transmission duct which serves to transmit laser radiation to the solder in the application nozzle. The application duct is inclined at an application angle &#x3b1; with respect to the rotation axis.

Device for the separate application of bonding material deposits

A device for the placing and contacting of a test contact of a test contact arrangement arranged on a contact carrier featuring a contact head having at least one transmission channel for transmitting thermal energy and transferring a vacuum. The contact head is provided with a test contact receptacle at its contact end in the area of a channel mouth, the test contact receptacle having a receiving gap formed between two parallel receiving cheeks for receiving the test contact and connected with the transmission channel. The receiving cheeks have contact surfaces at their contact ends for contacting a solder deposit arranged on the contact carrier to produce a heat conducting contact with the solder material of the solder deposit.

Device for removing a test contact of a test contact arrangement

The invention concerns a method for producing a chip module having a carrier substrate and at least one chip arranged on the carrier substrate, as well as a contact conductor arrangement for connecting chip pads to contacts arranged on a contact face of the chip module, in which method the front face of the chip which is provided with the chip pads is secured to the carrier substrate and then the contact conductor arrangement is formed by structuring of a contact material layer of the carrier substrate.

Method for producing a chip module

The invention relates to a device () for the separate application of solder material deposits, in particular solder balls, comprising a conveying device for separately conveying the solder material deposits from a solder material reservoir toward an application device (), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position P, in which a solder material deposit is received from the solder material reservoir, into a transfer position P, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to the application device into an application position P, wherein a removal device () for removing a solder material deposit from a transport holder arranged in a removal position Pis arranged downstream of the transfer position in the conveying direction, the removal device being connected to a detector device for triggering the removal function, said detector device checking the condition of the transport holder in the transfer position.

Device for the separate application of connecting material deposits

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

Method for forming solder deposits

The invention relates to a device () for the separate application of solder material deposits (), in particular solder balls, comprising a conveying device () for separately conveying the solder material deposits from a solder material reservoir () toward an application device (), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to an application opening () of an application nozzle () of the application device into an application position P, wherein a first detector device () for triggering a treatment of the solder material deposit arranged in the application position Pwith laser radiation emitted by a laser device and a second detector device () for locating the solder material deposit are provided.

The invention relates to a chip arrangement () comprising a terminal substrate () and a plurality of semiconductor substrates () which are arranged on the terminal substrate, in particular chips, wherein terminal faces () arranged on a contact surface of the chips () are connected to terminal faces on a contact surface () of the terminal substrate (), wherein the chips () extend parallel with a lateral edge and transversally with their contact surface to the contact surface of the terminal substrate (), wherein vias () are arranged in the terminal substrate, which connect external contacts () arranged on an external contact side to terminal faces formed as internal contacts () on the contact surface of the terminal substrate, wherein terminal faces of the chips, which are arranged adjacent to the lateral edge, are connected to the internal contacts of the terminal substrate by way of a re-melted solder material deposit (). Furthermore, the invention relates to a method for producing a chip arrangement ().

Semiconductor chip assembly and method for manufacturing the same

A method for electrically contacting terminal faces of two substrates, such as a chip and a carrier substrate, includes two successive phases. In a first phase, the chip is positioned with its terminal faces against terminal faces of the substrate and laser energy is applied to the chip at the rear. In a second phase, a flux medium is applied and laser energy is applied to the rear of the chip to cause reflow. The device for performing the second phase of the method comprises a carrier table and a housing, which form a housing interior with a top side of the carrier table which receives the component arrangement, and a laser light source, which is oriented so that the laser radiation impinges on the rear side of the first substrate.

Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium

A method and device for transferring a chip () situated on a transfer substrate () to a contact substrate (), and for contacting the chip with the contact substrate, in which the chip, the back side () of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts () thereof that are arranged opposite a contact surface () of the contact substrate are brought into contact with substrate contacts () arranged on the contact surface by means of a pressing device () from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.

Method and device for transferring a chip to a contact substrate

The invention relates to a method and a device for contacting a solder ball formation, in which a plurality of contact mouthpieces arranged in a formation is used to pick up a solder ball formation with a composition reflecting the relative arrangement of the contact mouthpieces from a solder ball reservoir comprising a multitude of randomly distributed solder balls, the solder ball formation is placed on contact points by means of the contact mouthpieces for subsequently contacting, and subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points.

Method and device for contacting, positioning and impinging a solder ball formation with laser energy

The invention relates to a test contact arrangement () for testing semiconductor components, comprising at least one test contact () which is arranged in a test contact frame () and is designed in the type of a cantilever arm and which has a fastening base () and a contact arm () which is provided with a contact tip () and which is connected to the fastening base, wherein the fastening base is inserted with a fastening projection () thereof into a frame opening () of the test contact frame in such a manner that a lower edge () of the fastening projection is essentially aligned flush with a lower side () of the test contact frame.

Test contact arrangement

A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.

Growing community of inventors

Berlin, Germany

Ghassem Azdasht