Austin, TX, United States of America

Byung-Jin Choi

This inventor holds 145 USPTO granted patents and 39 published patent applications and 19 EPO patents, primarily in Nanoimprint Lithography (CPC class G03F7-0002). Top assignees: Molecular Imprints, Inc., Canon Kabushiki Kaisha, Canon Nanotechnologies, Inc.. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung-Jin Choi. Retrieved from https://idiyas.com/inventor/byung-jin-choi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 145 

% Patents Active = 84.1

 

Average Co-Inventor Count = 2.6

ph-index = 19

Forward Citations = 1,058(Granted Patents)

Forward Citations (Not Self Cited) = 790(Dec 10, 2025)


Inventors with similar research interests:

🔬 See more inventors

Location History:

  • Austn, TX (US) (2008)
  • Round Rock, TX (US) (2006 - 2010)
  • Tokyo, JP (2020)
  • Austin, TX (US) (2005 - 2024)

Company Filing History:


Years Active: 2005-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Nanoimprint Lithography
Wafer Processing
Planarization Techniques
Template Replication
Bonding Heads
Overlay Improvement
Chip Bonding
Cooling Substrates
Alignment Control
Transformation Patterns
Superstrate Chuck
Imprint Apparatus
145 patents (USPTO):Explore Patents

Title: Byung-Jin Choi: Innovator Extraordinaire in Austin, TX

Introduction:

In the world of inventions and patents, few names stand out like Byung-Jin Choi, an eminent innovator based in Austin, Texas. With an impressive repertoire of 123 patents, Choi has made groundbreaking contributions to various fields. This article explores his latest patents, career highlights, collaborations, and the impact of his work in the industry.

Latest Patents:

Byung-Jin Choi's recent patents demonstrate his versatility and ingenuity. Two notable patents among his latest creations include:

1. Chuck Assembly: This patent describes a chuck assembly designed to securely hold a plate. By utilizing a flexible portion with a central opening, the plate is held in place by reducing pressure in the cavity. The assembly features a light-transmitting member and fluid path for efficient pressurization.

2. Method, System, and Apparatus for Cooling a Substrate: This patent presents techniques and mechanisms for cooling a substrate within a processing chamber. The bi-directional cooling process involves introducing first cooling gas from above and second cooling gas from below the substrate. By cutting gaps in the apparatus's body, contact with the support structure holding the substrate is avoided during horizontal movement.

Career Highlights:

Byung-Jin Choi has an illustrious career, with significant contributions made during his tenure at renowned companies such as Molecular Imprints, Inc. and Canon Kabushiki Kaisha. His innovative ideas and drive for excellence have led to numerous breakthroughs within these organizations.

Collaborations:

Throughout his career, Choi has had the privilege of collaborating with exceptional colleagues, enhancing the impact of his inventions. Notable co-workers include Sidlgata V Sreenivasan and Mario Johannes Meissl. Working together, these individuals have pushed the boundaries of innovation, paving the way for groundbreaking advancements in their respective fields.

Conclusion:

Byung-Jin Choi's remarkable achievements in the realm of inventions and patents are a testament to his brilliance and dedication. With 123 patents to his name, Choi has demonstrated unparalleled ingenuity across multiple domains. His latest patents, including the chuck assembly and substrate cooling apparatus, offer practical solutions to complex challenges. Collaborating with outstanding individuals, Choi continues to make invaluable contributions to the world of innovation, leaving an indelible mark on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…