Molecular Imprints, Inc.

Canon Kabushiki Kaisha

Canon Nanotechnologies, Inc.

University of Texas System

Other

Byung-Jin Choi

Sidlgata V Sreenivasan

Mario Johannes Meissl

Anshuman Cherala

Pawan Kumar Nimmakayala

Seth J Bamesberger

Xiaoming Lu

Frank Y Xu

Daniel Babbs

Ian Matthew McMackin

Michael P C Watts

Philip D Schumaker

Gerard M Schmid

Michael Nevin Miller

Todd Christopher Bailey

Ronald D Voisin

Steven C Shackleton

Matthew Earl Colburn

Pankaj B Lad

Carlton Grant Willson

Douglas J Resnick

Norman E Schumaker

John G Ekerdt

Yoshikazu Miyajima

Niyaz Khusnatdinov

Nilabh Kumar Roy

Zhengmao Ye

Stephen C Johnson

Kang Luo

Van Nguyen Truskett

Kosta S Selinidis

Vikramjit Singh

Weijun Liu

Yeong-Jun Choi

Mahadevan Ganapathisubramanian

Mahadevan GanapathiSubramanian

Tom H Rafferty

Se-Hyuk Im

Ozkan Ozturk

Ecron D Thompson

Alireza Aghili

Masaki Saito

Se Hyun Ahn

Alex Ruiz

Makoto Mizuno

Nicholas A Stacey

Liang Kai Wang

Nobuto Kawahara

Sidigata V Sreenivasan

Avinash Panga

Se-Hyun Ahn

Edward Brian Fletcher

Yukio Takabayashi

Tsuyoshi Arai

Shrawan Singhal

Hillman Bailey

Osamu Yasunobe

Naoki Murasato

Takahiro Yoshida

Ahmed M Hussein

Satoshi Iwatani

Steven T Jenkins

Jae Hong Kim

Jeffrey Dean Klein

Wei Zhang

Angelo Fancello

Mingji Lou

Christopher Mark Melliar-Smith

Phillip D Schumaker

Jeremy Sevier

Matthew M Kincaid

Steven Hartmann

Mattherw E Colburn

Darren D Donaldson

Kosta Selinidis

Michael PC Watts

Mario J Maissl

Doublas J Resnick

Ian M Mcmackin

Hillman L Bailey

Daniel A Babbs

Anshuman c/o Molecular Imprints Inc Cherala

An apparatus can include a bonding head. The bonding head can include a bonding head body, a die chuck body, and lands. The bonding head body can be coupled to the die chuck. The lands can define zones. The lands and zones can be configured so that an outer zone can be under vacuum to hold a die while an inner zone is pressurized to cause the die to bow away from the bonding head. The bowed die has a relatively smoother curvature as compared to a die bent by bowing a die chuck that has pins, lands, or both. When the die contacts a substrate using the novel bonding head, the likelihood of trapping air and creating a void during a bonding operation is significantly reduced.

Apparatus including a bonding head and a method of using the same

An apparatus can include a chip transfer module that includes a chip chuck. The chip chuck can include a chucking surface that is configured to hold a chip. The chip chuck can further include a gap sensor that is configured to measure a distance between a sensor surface of the gap sensor and a surface spaced apart from the chip chuck. In an implementation, the surface can be an upper surface of a chip, a surface of a substrate, or a surface of a film or layer overlying the substrate. A method can be used to transfer a chip from a source substrate to a destination substrate, so that upper surfaces of chips on the destination substrate are co-planar or nearly co-planar.

Chip chuck and a method of using the same

Some devices, systems, and methods obtain one or more images of a substrate, wherein the substrate includes a feature pattern; determine one or more edges of the feature pattern based on the one or more images; determine an offset of the feature pattern relative to the substrate and an angle of the feature pattern relative to the substrate based on the one or more edges of the feature pattern; and generate a transformation for a drop pattern based on the offset of the feature pattern and on the angle of the feature pattern.

Devices, systems, and methods for the transformation and cropping of drop patterns

An apparatus can include a support structure and a docking station, wherein the apparatus is configured to move the docking station relative to the support structure. The apparatus can further include a head among a plurality of heads. The apparatus can also include a first coupler configured to couple the head to the support structure and to decouple the head from the support structure and a second coupler configured to couple the head to the docking station and to decouple the head from the docking station. A method of using the apparatus can include coupling the head to the docking station and decoupling the first head from the support structure. The method can further include moving the docking station along the support structure. The method can also include coupling the head to the support structure and decoupling the head from the docking station.

Apparatus including a plurality of heads and a method of using the same

A method of shaping a surface comprises dispensing formable material onto a substrate held by a substrate chuck, contacting a plate held by a plate chuck assembly with the formable material to form a film, curing the film to form a cured layer, initiating a separation front between the cured layer and the plate, tilting the plate chuck assembly and/or the substrate chuck in a direction away from the initial separation point, thereby propagating the separation front, applying a force to the plate chuck assembly and/or the substrate chuck away from the other while maintaining or increasing the tilt, until the separation front completely propagates around the cured layer, and continuing to apply the force, until the plate does not contact the cured layer. The plate chuck assembly includes a flexible portion with a central opening, and a cavity formed by the flexible portion. The plate is held by the flexible portion.

Method of shaping a surface, shaping system, and method of manufacturing an article

Some devices and systems comprise one or more walls of a reaction chamber; an adjustable gap in the one or more walls, wherein the adjustable gap is formed between a first gap surface and a second gap surface facing the first gap surface, and wherein a distance between the first gap surface and the second gap surface is adjustable; a plurality of stops, wherein each stop of the plurality of stops is positioned on either the first gap surface or the second gap surface, wherein the plurality of stops ensure a minimum distance of the adjustable gap, wherein a total length of the plurality of stops is less than 1% of a length of the first gap surface; and one or more vacuum ports in the first gap surface or the second gap surface.

Reaction chamber with stop-gapped vacuum seal

A system for forming a layer on a substrate, the system comprising a dispensing station configured to dispense formable material on the substrate, a shaping station configured to contact the dispensed formable material on the substrate with a plate, and a positioning system. The positioning system includes a hand configured to hold the substrate, a cover having an underside surface facing the hand and a topside surface opposite the underside surface, the cover being configured such that the underside surface covers the substrate and the dispensed formable material when the cover is positioned over the hand, and a plurality of support pads positioned on the topside surface of the cover, the plurality of support pads being configured to support the plate.

Layer forming system including cover with support pads, a positioning system with the cover and support pads, and a method of loading a plate

An apparatus is provided. The apparatus has a chuck having a first side configured to retain a superstrate or a template and a second side, an array of image sensors disposed at the second side of the chuck and spaced from the chuck, and an array of light sources disposed between the transparent chuck and the array of image sensors.

Wafer process, apparatus and method of manufacturing an article

A chuck assembly for holding a plate comprises a member configured to hold the plate, the member including a flexible portion configured to have a central opening, and a first cavity formed by the flexible portion, wherein the plate is held by the flexible portion by reducing pressure in the first cavity, a light-transmitting member covering the central opening of the member, and a fluid path in communication with a second cavity defined by the member, the plate held by the member and the light-transmitting member for pressurizing the second cavity.

Chuck assembly, planarization process, apparatus and method of manufacturing an article

A planarization apparatus comprising a superstrate chuck is provided. The superstrate includes a plurality of inner lands protruding from a surface of the superstrate chuck and a peripheral land protruding from the surface of the superstrate chuck along a periphery of the superstrate chuck and encircling the inner lands therein. The peripheral land has a height smaller than a height of each of the inner lands. The peripheral land has a width sufficiently larger than a width of each of the inner lands such that a pressure leakage through the peripheral land is controlled to be less than a threshold.

Planarization process, apparatus and method of manufacturing an article

An apparatus can include a source chuck, an array of pick-up heads, an array of bonding heads, and a product chuck. The source chuck can have a source holding surface facing a first direction. The array of pick-up heads can have pick-up surfaces facing a second direction opposite the first direction and configured to have an adjustable pitch that can be reversibly changed between a source-matching pitch and a bonding head-matching pitch. The array of bonding heads can have holding surfaces facing the first direction and configured to be at a bonding head pitch. The product chuck can have a product holding surface facing the second direction. The apparatus can be used to transfer chips from a source substrate to a product substrate and bond the chips to product bonding sites of the product substrate.

Apparatus including arrays of pick-up heads and bonding heads and a method of using the same

A forming apparatus forming a composition on a substrate by using a mold, includes a supplier configured to supply a composition on the substrate, a plurality of processors including a first processor and a second processor, each of the plurality of processors being configured to bring the mold into contact with the composition supplied onto the substrate by the supplier, and a substrate conveyer configured to convey the substrate onto which the composition is supplied by the supplier to the first processor and then convey other substrate onto which the composition is supplied following the substrate to the second processor.

Forming apparatus, forming method, and article manufacturing method

A method of planarizing a substrate comprises dispensing formable material onto a substrate, contacting a superstrate held by a superstrate chuck with the formable material on the substrate, thereby forming a multilayer structure including the superstrate, a film of the formable material, and the substrate, releasing the multilayer structure from the superstrate chuck, providing a space between the superstrate chuck and the multilayer structure after the releasing, positioning a light source into the provided space between the superstrate chuck and the multilayer structure, and curing the film of the multilayer structure by exposing the film to light emitted from the light source.

Planarization process, planarization system, and method of manufacturing an article

A planarization system comprises a substrate chuck configured to hold a substrate, a superstrate chuck configured to hold a superstrate, a planarizing head configured to support the superstrate chuck, a positioning system configured to cause the superstrate to come into contact with formable material dispensed on the substrate to form a multilayer structure, the multilayer structure including the superstrate, a film of the formable material, and the substrate, and an annular light source disposed between an upper end of the planarizing head and the substrate chuck. The annular light source is configured to emit light onto an outer annular region of the multilayer structure without emitting the light onto an inner central region of the multilayer structure. The inner central region is located radially inward relative to the outer annular region.

Planarization system, planarization process, and method of manufacturing an article

A method of loading a superstrate onto a superstrate chuck includes raising a plurality of pins located radially outward of a substrate chuck from a retracted position to a receiving position, placing the superstrate onto the plurality of pins while the plurality of pins are in the receiving position, and coupling the superstrate with the superstrate chuck while the superstrate is on the plurality of pins.

Method and system for loading a superstrate onto a superstrate chuck

Growing community of inventors

Austin, TX, United States of America

Byung-Jin Choi