The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Dec. 02, 2022
Canon Kabushiki Kaisha, Tokyo, JP;
Byung-Jin Choi, Austin, TX (US);
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
An apparatus can include a pick-up head including a non-contact die chuck for holding a die; a substrate chuck having a non-planar chucking surface configured to hold a source substrate; and a substrate retention module that is configured to provide a force in a direction from the source substrate toward the substrate chuck, wherein the force is sufficient to deform the source substrate. A method of using the apparatus can include placing a source substrate along a non-planar chucking surface of a source chuck, wherein a die is associated with the source substrate; and picking up the die from the source substrate using a pick-up head having a non-contact die chuck, wherein before picking up the die, the source substrate contacts spaced-apart portions of the die, and the source substrate does not contact another portion of die between the spaced-apart portions of the source substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile