The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Sep. 23, 2021
Canon Kabushiki Kaisha, Tokyo, JP;
Seth J. Bamesberger, Austin, TX (US);
Byung-Jin Choi, Austin, TX (US);
Xiaoming Lu, Cedar Park, TX (US);
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of shaping a surface comprises dispensing formable material onto a substrate held by a substrate chuck, contacting a plate held by a plate chuck assembly with the formable material to form a film, curing the film to form a cured layer, initiating a separation front between the cured layer and the plate, tilting the plate chuck assembly and/or the substrate chuck in a direction away from the initial separation point, thereby propagating the separation front, applying a force to the plate chuck assembly and/or the substrate chuck away from the other while maintaining or increasing the tilt, until the separation front completely propagates around the cured layer, and continuing to apply the force, until the plate does not contact the cured layer. The plate chuck assembly includes a flexible portion with a central opening, and a cavity formed by the flexible portion. The plate is held by the flexible portion.