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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12228854 B1

PDFFull Text
Date of Patent:
Feb. 18, 2025

Filed:

Nov. 12, 2021

Layer forming system including cover with support pads, a positioning system with the cover and support pads, and a method of loading a plate

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Byung-Jin Choi, Austin, TX (US);

Osamu Yasunobe, Utsunomiya, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Canon U.S.A., Inc. I.P. Division

Primary Examiner:

John J DeRusso

Assistant Examiner:

Victoria undefined Bartlett

Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); H01L 21/68 (2013.01); H01L 21/6838 (2013.01);
Abstract

A system for forming a layer on a substrate, the system comprising a dispensing station configured to dispense formable material on the substrate, a shaping station configured to contact the dispensed formable material on the substrate with a plate, and a positioning system. The positioning system includes a hand configured to hold the substrate, a cover having an underside surface facing the hand and a topside surface opposite the underside surface, the cover being configured such that the underside surface covers the substrate and the dispensed formable material when the cover is positioned over the hand, and a plurality of support pads positioned on the topside surface of the cover, the plurality of support pads being configured to support the plate.

Find Patent Forward Citations

Choi, Byung-Jin. (2025). Layer forming system including cover with support pads, a positioning system with the cover and support pads, and a method of loading a plate (U.S. Patent No. 12228854). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12228854

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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