The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Nov. 08, 2022
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Byung-Jin Choi, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/67259 (2013.01); H01L 21/68 (2013.01); H01L 21/681 (2013.01);
Abstract

An apparatus can include a chip transfer module that includes a chip chuck. The chip chuck can include a chucking surface that is configured to hold a chip. The chip chuck can further include a gap sensor that is configured to measure a distance between a sensor surface of the gap sensor and a surface spaced apart from the chip chuck. In an implementation, the surface can be an upper surface of a chip, a surface of a substrate, or a surface of a film or layer overlying the substrate. A method can be used to transfer a chip from a source substrate to a destination substrate, so that upper surfaces of chips on the destination substrate are co-planar or nearly co-planar.


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