The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Jul. 28, 2021
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Byung-Jin Choi, Austin, TX (US);
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B05D 3/06 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02348 (2013.01); B05D 3/067 (2013.01); H01L 21/0201 (2013.01); H01L 21/687 (2013.01);
Abstract
An apparatus is provided. The apparatus has a chuck having a first side configured to retain a superstrate or a template and a second side, an array of image sensors disposed at the second side of the chuck and spaced from the chuck, and an array of light sources disposed between the transparent chuck and the array of image sensors.
Choi, Byung-Jin. (2024). Wafer process, apparatus and method of manufacturing an article (U.S. Patent No. 12176208). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12176208
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile