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Kanagawa-pref, Taiwan

Speedfam Co Ltd

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USPTO Granted Patents = 57

% Expired Patents = 26.3

EPO Patents = 1

Forward Citations = 707

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60 inventors (with patents filed for the assignee):

Hatsuyuki Arai (11 out of 12 patents)

Shunji Hakomori (10 out of 18 patents)

Michihiko Yanagisawa (10 out of 19 patents)

4. Misuo Sugiyama (6 out of 6 patents)

5. Shigeto Izumi (5 out of 5 patents)

6. Tadayoshi Okuya (4 out of 4 patents)

7. Shinya Iida (4 out of 12 patents)

8. Isao Nagahashi (4 out of 9 patents)

9. Yusuke Inoue (3 out of 4 patents)

10. Hitoshi Nagayama (3 out of 3 patents)

11. Xu-Jin Wang (3 out of 3 patents)

12. Hideo Tanaka (3 out of 3 patents)

13. Hiroshi Yashiki (3 out of 4 patents)

14. Seiichi Maeda (3 out of 3 patents)

15. Kiyoshi Ikemoto (3 out of 3 patents)

Core Competencies:

Local Dry Etching

Polishing Composition

Wafer Table

Thickness Control

Plasma Etching

Chemical Mechanical Polishing

Surface Processing

Wafer Loading

Cleaning Device

Dresser Apparatus

Flattening Method

Slurry Recycling

57 patents: Sort by Forward Citations

1. 11145492 - Local dry etching apparatus (2021-10-12),

2. 8114178 - Polishing composition for semiconductor wafer and polishing method (2012-02-14),

3. 7147541 - Thickness control method and double side polisher (2006-12-12),

4. 7137867 - Thickness control method and double side polisher (2006-11-21),

5. 7094355 - Local dry etching method (2006-08-22),

6. 7005032 - Wafer table for local dry etching apparatus (2006-02-28),

7. 6908566 - Local dry etching method (2005-06-21),

8. 6875701 - Nanotopography removing method (2005-04-05),

9. 6840841 - Wafer edge polishing system (2005-01-11),

10. 6773335 - Apparatus for polishing periphery of device wafer and polishing method (2004-08-10),

11. 6649528 - Local dry etching method (2003-11-18),

12. 6638147 - Polishing method for removing corner material from a semi-conductor wafer (2003-10-28),

13. 6478660 - Apparatus of and method for polishing the outer circumferential portions of a circular plate-shaped work (2002-11-12),

14. 6432824 - Method for manufacturing a semiconductor wafer (2002-08-13),

15. 6429399 - Discharge tube for a local etching apparatus and a local etching apparatus using the discharge tube (2002-08-06),

Company Overview

Speedfam Co Ltd, based in Kanagawa Prefecture, specializes in semiconductor processing technologies. The company focuses on developing advanced solutions in local dry etching, chemical mechanical polishing, and plasma etching, catering to the needs of the semiconductor industry. With expertise in polishing compositions and wafer handling technologies, Speedfam is dedicated to enhancing surface processing and thickness control, ensuring high-quality outcomes for semiconductor manufacturing applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

57 Patents

#1 in Kanagawa-pref

#10 in Taiwan

#12,581 in the World

Kanagawa-pref, Taiwan

Speedfam Co Ltd

Forward Citations = 707

60 inventors:

Hatsuyuki Arai (11 out of 12 patents)

Shunji Hakomori (10 out of 18 patents)

Michihiko Yanagisawa (10 out of 19 patents)

4. Misuo Sugiyama (6 out of 6 patents)

5. Shigeto Izumi (5 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Speedfam Co Ltd. Retrieved from https://idiyas.com/company/speedfam-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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