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For the Inventor, By the Inventor

Yokohama, Japan

Hitoshi Nagayama

This inventor holds 3 USPTO granted patents. Top assignee: Speedfam Co Ltd. Active years: 2000-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hitoshi Nagayama. Retrieved from https://idiyas.com/inventor/hitoshi-nagayama-1l5kblq2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3

% Patents Active = 33.3

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 44(Granted Patents)


Location History:

  • Ayase, JP (2000)
  • Yokohama, JP (2006)

Company Filing History:

goldMedal3 out of 57 
 
Speedfam Co Ltd
 patents

Years Active: 2000-2006

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3 patents (USPTO):Explore Patents
1. 7147541 - Thickness control method and double side polisher (2006-12-12),
2. 7137867 - Thickness control method and double side polisher (2006-11-21),
3. 6039638 - Work planarizing method and apparatus (2000-03-21),

Title: Inventor Hitoshi Nagayama

Introduction: Hitoshi Nagayama is a renowned inventor based in Yokohama, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Hitoshi Nagayama holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Hitoshi Nagayama has worked with leading research institutions and universities to develop cutting-edge solutions that have revolutionized industries worldwide.

Collaborations: Throughout his career, Hitoshi Nagayama has collaborated with top companies, banks, and tech giants to bring his inventions to the market, solidifying his reputation as a visionary inventor.

Conclusion: Hitoshi Nagayama's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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