The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
Apr. 22, 2008
Masahiro Izumi, Tokyo, JP;
Shinsuke Miyabe, Tokyo, JP;
Kuniaki Maejima, Tokyo, JP;
Hiroaki Tanaka, Kanagawa, JP;
Masahiro Izumi, Tokyo, JP;
Shinsuke Miyabe, Tokyo, JP;
Kuniaki Maejima, Tokyo, JP;
Hiroaki Tanaka, Kanagawa, JP;
Nippon Chemical Industrial Co., Ltd., Tokyo, JP;
Speedfam Co., Ltd., Ayase-shi, JP;
Abstract
The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor wafer comprises colloidal silica consisting of non-spherical silica particles having a ratio of long axis to short axis of 1.5 to 15. The polishing method for a semiconductor wafer uses the polishing composition. The polishing composition can provide a remarkably high polishing rate compared with a polishing composition using spherical colloidal silica, and can provide good mirror-polishing without causing scratches. In addition, small alkali metal content enables reduction of adverse effects on a semiconductor wafer, such as residual abrasives after polishing.