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For the Inventor, By the Inventor

Ayase, Japan

Hatsuyuki Arai

This inventor holds 12 USPTO granted patents. Top assignees: Speedfam Co Ltd, Speedfam Corporation. Active years: 1989-2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hatsuyuki Arai. Retrieved from https://idiyas.com/inventor/hatsuyuki-arai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12

% Patents Active = 100.0

Average Co-Inventor Count = 1.7

ph-index = 10

Forward Citations = 285(Granted Patents)


Location History:

  • Zama, JP (1989 - 1997)
  • Ayase, JP (1997 - 2000)
  • Kanagawa-ken, JP (2000)
  • Kanagawa, JP (2000)

Company Filing History:

goldMedal11 out of 57 
 
Speedfam Co Ltd
 patents
silverMedal1 out of 49 
 
Speedfam Corporation
 patents

Years Active: 1989-2000

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12 patents (USPTO):Explore Patents
1. 6110026 - Carrier and polishing apparatus (2000-08-29),
2. 6074277 - Polishing apparatus (2000-06-13),
3. 6068545 - Workpiece surface processing apparatus (2000-05-30),
4. 6066230 - Planarization method, workpiece measuring method, and surface (2000-05-23),
5. 6040244 - Polishing pad control method and apparatus (2000-03-21),
6. 6030488 - Chemical and mechanical polishing apparatus (2000-02-29),
7. 6012964 - Carrier and CMP apparatus (2000-01-11),
8. 5916009 - Apparatus for applying an urging force to a wafer (1999-06-29),
9. 5685766 - Polishing control method (1997-11-11),
10. 5605499 - Flattening method and flattening apparatus of a semiconductor device (1997-02-25),
11. 5099614 - Flat lapping machine with sizing mechanism (1992-03-31),
12. 4805348 - Flat lapping machine (1989-02-21),

Title: Innovations of Hatsuyuki Arai

Introduction

Hatsuyuki Arai is a notable inventor based in Ayase, Japan. He has made significant contributions to the field of polishing apparatuses, holding a total of 12 patents. His work focuses on enhancing the precision and efficiency of polishing processes, which are crucial in various manufacturing sectors.

Latest Patents

One of Arai's latest patents is a carrier and polishing apparatus designed to enable high precision polishing of workpieces while preventing leak contamination and damage. This innovative apparatus features a carrier body, a pressure chamber, and a fluid passage portion, along with specially designed valve portions. The unique mechanism allows for the suction of wafers when the pressure chamber is in a negative pressure state and uniformly presses the wafer when in a positive pressure state. Another significant patent is a polishing apparatus that prevents uneven wear of the platen, thereby improving the operating rate. This apparatus includes a platen divided into inner and outer peripheral portions that rotate in opposite directions, ensuring equal wear on the polishing pads.

Career Highlights

Arai has worked with prominent companies such as Speedfam Co. Ltd and Speedfam Corporation. His experience in these organizations has contributed to his expertise in developing advanced polishing technologies.

Collaborations

Some of Arai's notable coworkers include Misuo Sugiyama and Shigeto Izumi. Their collaboration has likely played a role in the innovative advancements in polishing apparatuses.

Conclusion

Hatsuyuki Arai's contributions to the field of polishing technology are significant, with a focus on precision and efficiency. His patents reflect a deep understanding of the challenges in the industry and offer innovative solutions to enhance manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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