The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 1997
Filed:
Nov. 30, 1995
Applicant:
Inventors:
Wayne Mattingly, Canyon Country, CA (US);
Hatsuyuki Arai, Zama, JP;
Assignee:
Speedfam Corporation, Des Plaines, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24C / ;
U.S. Cl.
CPC ...
451 36 ; 451 41 ; 451 59 ; 451-5 ; 451-9 ;
Abstract
Polishing of wafers, such as wafers of semiconductive material is carried out by mounting the wafer to a carrier, and pressing the wafer against a polishing pad carrying a polishing media. An antenna is placed beneath the polishing pad and electrical energization is applied between the carrier assembly and the antenna. The electrical energization preferably includes a direct current bias, but may also include ratio frequency carrier injection signal. The noise associated with ionic disassociation is monitored to assess ongoing polishing activity, on a real time basis.