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Chandler, AZ, United States of America

Speedfam Corporation

USPTO Granted Patents = 49

Trademarks = 4

Forward Citations = 1,183

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50 inventors (with patents filed for the assignee):

Joseph V Cesna (13 out of 21 patents)

Chris E Karlsrud (12 out of 23 patents)

Clinton O Fruitman (4 out of 16 patents)

4. Paul L Holzapfel (4 out of 15 patents)

5. Isao Nagahashi (4 out of 9 patents)

6. Anthony G Van Woerkom (4 out of 4 patents)

7. Shigeru Odagiri (3 out of 3 patents)

8. Lawrence O Day (3 out of 3 patents)

9. Anthony L Bartels (3 out of 5 patents)

10. Warren Lin (3 out of 5 patents)

11. Eric C Shurtliff (3 out of 5 patents)

12. David M McNamara (3 out of 3 patents)

13. Stephen A Boettcher (3 out of 3 patents)

14. Robert F Allen (2 out of 15 patents)

15. Michael Manseau (2 out of 4 patents)

Core Competencies:

Chemical-Mechanical Planarization

Wafer Polishing

Thin-Film Magnetic Heads

Polishing Apparatus

Endpoint Detection

Cleaning Station

Abrasive Particles

Polishing Pad Conditioning

Dual Column Abrading Machine

Fluid Polishing Media

Slurry Regulator

Grinding Composition

49 patents: Sort by Forward Citations

1. 6555466 - Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers (2003-04-29),

2. 6045431 - Manufacture of thin-film magnetic heads (2000-04-04),

3. 6030280 - Apparatus for holding workpieces during lapping, honing, and polishing (2000-02-29),

4. 6001005 - Polishing apparatus (1999-12-14),

5. 5997390 - Polishing apparatus with improved alignment of polishing plates (1999-12-07),

6. 5975094 - Method and apparatus for enhanced cleaning of a workpiece with (1999-11-02),

7. 5972162 - Wafer polishing with improved end point detection (1999-10-26),

8. 5957763 - Polishing apparatus with support columns supporting multiple platform (1999-09-28),

9. 5954888 - Post-CMP wet-HF cleaning station (1999-09-21),

10. 5921849 - Method and apparatus for distributing a polishing agent onto a polishing (1999-07-13),

11. 5916015 - Wafer carrier for semiconductor wafer polishing machine (1999-06-29),

12. 5899216 - Apparatus for rinsing wafers in the context of a combined cleaning (1999-05-04),

13. 5885312 - Grinding composition using abrasive particles on bubbles (1999-03-23),

14. 5872633 - Methods and apparatus for detecting removal of thin film layers during (1999-02-16),

15. 5870792 - Apparatus for cleaning wafers and discs (1999-02-16),

Speedfam Corporation, headquartered in Chandler, AZ, specializes in advanced manufacturing technologies, particularly in the field of semiconductor processing. The company is recognized for its expertise in chemical-mechanical planarization, wafer polishing, and the development of innovative polishing apparatus. Speedfam's research encompasses critical areas such as endpoint detection, polishing pad conditioning, and abrasive slurry regulation, contributing to enhanced precision and efficiency in the production of thin-film magnetic heads and other semiconductor components.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

Speedfam Corporation

49 Patents

#8 in Chandler, AZ

#84 in Arizona

#7,138 in US

#14,266 in the World

Chandler, AZ, United States of America

Speedfam Corporation

Forward Citations = 1,183

50 inventors:

Joseph V Cesna (13 out of 21 patents)

Chris E Karlsrud (12 out of 23 patents)

Clinton O Fruitman (4 out of 16 patents)

4. Paul L Holzapfel (4 out of 15 patents)

5. Isao Nagahashi (4 out of 9 patents)

Please report any incorrect information to [email protected]

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