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Chandler, AZ, United States of America

Speedfam Corporation

USPTO Granted Patents = 49

Trademarks = 4

Forward Citations = 1,172

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50 inventors (with patents filed for the assignee):

Joseph V Cesna (13 out of 21 patents)

Chris E Karlsrud (12 out of 23 patents)

Clinton O Fruitman (4 out of 16 patents)

4. Paul L Holzapfel (4 out of 15 patents)

5. Isao Nagahashi (4 out of 9 patents)

6. Anthony G Van Woerkom (4 out of 4 patents)

7. Shigeru Odagiri (3 out of 3 patents)

8. Lawrence O Day (3 out of 3 patents)

9. Anthony L Bartels (3 out of 5 patents)

10. Warren Lin (3 out of 5 patents)

11. Eric C Shurtliff (3 out of 5 patents)

12. David M McNamara (3 out of 3 patents)

13. Stephen A Boettcher (3 out of 3 patents)

14. Robert F Allen (2 out of 15 patents)

15. Michael Manseau (2 out of 4 patents)

Core Competencies:

Chemical-Mechanical Planarization

Thin-Film Magnetic Heads

Wafer Polishing

Polishing Apparatus

Endpoint Detection

Polishing Pad Conditioning

Abrasive Slurry Regulator

In-Situ Polishing Control

Grinding Composition

Dual Column Abrading Machine

Workpiece Detection

Automated Free Abrasive Machine

49 patents: Sort by Forward Citations

1. 6555466 - Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers (2003-04-29),

2. 6045431 - Manufacture of thin-film magnetic heads (2000-04-04),

3. 6030280 - Apparatus for holding workpieces during lapping, honing, and polishing (2000-02-29),

4. 6001005 - Polishing apparatus (1999-12-14),

5. 5997390 - Polishing apparatus with improved alignment of polishing plates (1999-12-07),

6. 5975094 - Method and apparatus for enhanced cleaning of a workpiece with (1999-11-02),

7. 5972162 - Wafer polishing with improved end point detection (1999-10-26),

8. 5957763 - Polishing apparatus with support columns supporting multiple platform (1999-09-28),

9. 5954888 - Post-CMP wet-HF cleaning station (1999-09-21),

10. 5921849 - Method and apparatus for distributing a polishing agent onto a polishing (1999-07-13),

11. 5916015 - Wafer carrier for semiconductor wafer polishing machine (1999-06-29),

12. 5899216 - Apparatus for rinsing wafers in the context of a combined cleaning (1999-05-04),

13. 5885312 - Grinding composition using abrasive particles on bubbles (1999-03-23),

14. 5872633 - Methods and apparatus for detecting removal of thin film layers during (1999-02-16),

15. 5870792 - Apparatus for cleaning wafers and discs (1999-02-16),

Speedfam Corporation is a leading manufacturer of high precision surface finishing equipment and consumables for diverse industries such as semiconductor, hard disk drive, LED, and solar cell manufacturing. With over 60 years of experience, Speedfam offers a wide range of products including grinding and polishing machines, lapping machines, diamond abrasives, and CMP slurries. Their solutions are designed to provide customers with superior performance, efficiency, and reliability. Speedfam Corporation is committed to delivering innovative and cutting-edge technologies that meet the evolving needs of their clients worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

49 Patents

#11 in Chandler, AZ

#88 in Arizona

#6,915 in US

#13,865 in the World

Chandler, AZ, United States of America

Speedfam Corporation

Forward Citations = 1,172

50 inventors:

Joseph V Cesna (13 out of 21 patents)

Chris E Karlsrud (12 out of 23 patents)

Clinton O Fruitman (4 out of 16 patents)

4. Paul L Holzapfel (4 out of 15 patents)

5. Isao Nagahashi (4 out of 9 patents)

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