Chandler, AZ, United States of America

Anthony G Van Woerkom


Average Co-Inventor Count = 3.3

ph-index = 4

Forward Citations = 379(Granted Patents)


Location History:

  • Chandler, AZ (US) (1994 - 1996)
  • Gilbert, AZ (US) (1996)

Company Filing History:


Years Active: 1994-1996

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4 patents (USPTO):Explore Patents

Title: The Innovations of Anthony G Van Woerkom

Introduction

Anthony G Van Woerkom is a notable inventor based in Chandler, AZ (US), recognized for his contributions to the field of wafer polishing technology. With a total of four patents to his name, he has made significant advancements that enhance the efficiency and precision of wafer polishing processes.

Latest Patents

One of his latest patents is a wafer polishing method and apparatus. This innovative apparatus includes a wafer polishing assembly that features multiple wafer carriers, allowing for the simultaneous polishing of several wafers against a rotating polishing surface. The design enables a plurality of wafers to be loaded into the wafer carriers at once, utilizing a wafer holding apparatus of an index table. Additionally, the apparatus allows for the simultaneous unloading of polished wafers back into the index table. Each wafer carrier is individually controlled by a computer, ensuring precise polishing and accommodating different polishing requirements concurrently.

Career Highlights

Anthony G Van Woerkom has made a significant impact in his field while working at Speedfam Corporation. His expertise in wafer polishing technology has positioned him as a key figure in the development of advanced polishing solutions.

Collaborations

Throughout his career, Anthony has collaborated with talented individuals such as Chris E Karlsrud and Shigeru Odagiri, contributing to the innovative projects at Speedfam Corporation.

Conclusion

Anthony G Van Woerkom's work in wafer polishing technology exemplifies the spirit of innovation and dedication to improving manufacturing processes. His patents reflect a commitment to advancing the industry and enhancing the capabilities of wafer polishing systems.

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