Company Filing History:
Years Active: 1998-1999
Title: Innovations by Warren Lin in Chemical Mechanical Polishing
Introduction
Warren Lin is a notable inventor based in Fremont, California, recognized for his contributions to the field of chemical mechanical polishing (CMP). With a total of five patents to his name, Lin has developed innovative methods that enhance the efficiency and effectiveness of CMP processes. His work has significantly impacted the semiconductor manufacturing industry.
Latest Patents
One of Lin's latest patents is titled "Methods for the in-process detection of workpieces in a CMP environment." This method involves applying an optical interrogation signal to a workpiece during the CMP process. An optical probe assembly generates a light signal that interacts with the polishing pad, allowing for the detection of a workpiece's presence. By analyzing the scattered light signals, the method can effectively identify lost or broken workpieces.
Another significant patent is "Methods for the in-process detection of workpieces with a monochromatic." This method utilizes an infrared LED emitter to generate an interrogation signal directed toward the polishing pad. The reflected signal is processed to produce a control signal that indicates the presence of extraneous material near the polishing pad. This innovation allows for the use of various polishing pads without needing to alter the emitter's position or the apparatus's operating parameters.
Career Highlights
Warren Lin has worked with several companies throughout his career, including Speedfam Corporation and Speedfam-IPEC Corporation. His experience in these organizations has contributed to his expertise in CMP technologies and innovations.
Collaborations
Lin has collaborated with notable coworkers such as Paul L. Holzapfel and Anthony L. Bartels, further enhancing his work in the field of chemical mechanical polishing.
Conclusion
Warren Lin's innovative patents and career achievements have made a significant impact on the CMP industry. His methods for detecting workpieces during the CMP process demonstrate his commitment to advancing technology in semiconductor manufacturing.
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