The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 1999
Filed:
Jan. 06, 1998
Applicant:
Inventor:
Joseph V Cesna, Niles, IL (US);
Assignee:
Speedfam Corporation, Chandler, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
156345 ; 451-6 ; 451 41 ;
Abstract
A probe assembly is provided for semiconductor wafer polishing and similar wafer treatments. The polishing table forms a recess for receiving the probe, with the probe free end located to view interior portions of a semiconductor wafer temporarily passing over the recess. Probe data may conveniently be used for polishing end point determination.