The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2000
Filed:
Mar. 01, 1999
Hatsuyuki Arai, Kanagawa-ken, JP;
SpeedFam Co., Ltd., , JP;
Abstract
A polishing apparatus prevents uneven wear of the platen and improves the operating rate of the apparatus. The polishing apparatus provided with a platen 1 divided into an inner peripheral platen portion 11 and an outer peripheral platen portion 13 and with a carrier 5, wherein by making the inner peripheral platen portion 11 and the outer peripheral platen portion 13 rotate in opposite directions and setting the rotational speeds of the inner peripheral platen portion 11 and the outer peripheral platen portion 13 so that the mean relative speed of a wafer 200 and the inner peripheral platen portion 11 and the mean relative speed of the wafer 200 and the outer peripheral platen portion 13 become substantially equal, it becomes possible to make the amount of wear of the polishing pad 11a of the inner peripheral platen portion 11 and the amount of wear of the polishing pad 13a of the outer peripheral platen portion 13 substantially equal. Preferably, the wafer 200 is made to oscillate so that the wafer 200 overhangs from the inner edge of the inner peripheral platen portion 11 and the outer edge of the outer peripheral platen portion 13.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile