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For the Inventor, By the Inventor

Kanagawa, Japan

Shunji Hakomori

This inventor holds 18 USPTO granted patents. Top assignees: Speedfam Co Ltd, Speedfam-Ipec Co Ltd, Speedfam-Pec Co Ltd. Active years: 1992-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shunji Hakomori. Retrieved from https://idiyas.com/inventor/shunji-hakomori

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18

% Patents Active = 77.8

Average Co-Inventor Count = 1.4

ph-index = 7

Forward Citations = 156(Granted Patents)


Location History:

  • Hayakawa, Ayase-shi, JP (2000)
  • Ayase-shi, JP (2000 - 2001)
  • Ayase, JP (1999 - 2002)
  • Kanagawa, JP (2002 - 2004)
  • Tokyo, JP (1992 - 2005)

Company Filing History:

goldMedal10 out of 57 
 
Speedfam Co Ltd
 patents
silverMedal1 out of 6 
 
Speedfam-Ipec Co Ltd
 patents
bronzeMedal1 out of 1 
 
Speedfam-Pec Co Ltd
 patent
4. 6 out of 834,513 
Other
 patents

Years Active: 1992-2005

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18 patents (USPTO):Explore Patents
1. 6840841 - Wafer edge polishing system (2005-01-11),
2. 6773335 - Apparatus for polishing periphery of device wafer and polishing method (2004-08-10),
3. 6478660 - Apparatus of and method for polishing the outer circumferential portions of a circular plate-shaped work (2002-11-12),
4. 6422930 - Apparatus for removing deposited film (2002-07-23),
5. 6402596 - Single-side polishing method for substrate edge, and apparatus therefor (2002-06-11),
6. 6290580 - Polishing method for silicon wafers which uses a polishing compound which reduces stains (2001-09-18),
7. 6261160 - Method and apparatus for specular-polishing of work edges (2001-07-17),
8. 6250995 - Apparatus for polishing outer periphery of workpiece (2001-06-26),
9. 6210260 - Carrier and CMP apparatus (2001-04-03),
10. 6196906 - Surface polishing apparatus and method of taking out workpiece (2001-03-06),
11. 6159081 - Method and apparatus for mirror-polishing of workpiece edges (2000-12-12),
12. 6155908 - Work-loading method and surface-grinding apparatus with work position (2000-12-05),
13. 6139408 - Surface grinding machine and carrier used therefor (2000-10-31),
14. 6116997 - Single side work polishing apparatus (2000-09-12),
15. 6113490 - Work unloading method and surface polishing apparatus with work (2000-09-05),

Title: Shunji Hakomori: Innovator in Wafer Polishing Technology

Introduction

Shunji Hakomori is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of wafer polishing technology, holding a total of 18 patents. His innovative approaches have led to advancements that improve efficiency and reduce costs in semiconductor manufacturing.

Latest Patents

One of Hakomori's latest patents is a wafer edge polishing system. This system enhances throughput and lowers average processing costs by incorporating a wafer inspection unit. In this system, a wafer is polished in a dedicated unit and then transported to an inspection unit. If the inspection reveals that the polishing is inadequate, the wafer is returned for further polishing. Another notable patent is for an apparatus designed for polishing the periphery of a device wafer. This invention allows for simultaneous polishing of the inclined faces, peripheral face, and peripheral edge of the wafer, effectively removing unnecessary parts of a metallic film.

Career Highlights

Throughout his career, Hakomori has worked with Speedfam Co Ltd, where he has been instrumental in developing advanced polishing technologies. His work has significantly impacted the efficiency of semiconductor production processes.

Collaborations

Hakmori has collaborated with notable professionals in the field, including Noriaki Mizuno and Toru Asai. Their combined expertise has contributed to the success of various projects and innovations.

Conclusion

Shunji Hakomori's contributions to wafer polishing technology exemplify his innovative spirit and dedication to improving manufacturing processes. His patents and collaborations continue to influence the semiconductor industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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