Misuo Sugiyama is a prominent inventor based in Ayase, Japan. He has made significant contributions to the field of wafer processing technology, holding a total of 6 patents. His innovative designs focus on improving the efficiency and effectiveness of wafer production.

Latest Patents

Sugiyama's latest patents include a "Carriers and Polishing Apparatus" and a "Carrier and CMP Apparatus." The "Carriers and Polishing Apparatus" is designed to enhance the mass producibility of wafers by utilizing a retainer ring made from a soft material. This design features a rubber sheet bonded to the bottom surface of the carrier body, creating a pressure chamber. The retainer ring is also bonded to the bottom surface of the sheet, ensuring optimal performance. The "Carrier and CMP Apparatus" consists of a disk-shaped body with fluid circulation holes and a pliable diaphragm portion. This innovative design allows for effective pressure management during the wafer processing.

Career Highlights

Sugiyama is currently employed at Speedfam Co Ltd, where he continues to develop cutting-edge technologies in wafer processing. His work has significantly impacted the industry, leading to advancements in production techniques and equipment.

Collaborations

Throughout his career, Sugiyama has collaborated with notable colleagues, including Hatsuyuki Arai and Xu-Jin Wang. These partnerships have fostered innovation and contributed to the success of various projects.

Conclusion

Misuo Sugiyama's contributions to wafer processing technology exemplify his dedication to innovation. His patents and career achievements highlight his role as a leading inventor in the field.

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