The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Jul. 01, 1999
Applicant:
Inventors:
Xu-Jin Wang, Ayase, JP;
Shigeto Izumi, Ayase, JP;
Misuo Sugiyama, Ayase, JP;
Hideo Tanaka, Ayase, JP;
Assignee:
SpeedFam Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 2/900 ;
U.S. Cl.
CPC ...
B24B 2/900 ;
Abstract
A carrier and a polishing apparatus are designed to improve the mass producibility of wafers while using a retainer ring formed by a soft material. A rubber sheet,is bonded to the bottom surface of a carrier body,of the carrier,to define a pressure chamber R, a retainer ring,formed by a soft material such as EG is bonded to the bottom surface of the sheet,. A margin block,is provided projecting out from the bottom side of the sheet,, and the thickness of the retainer ring,is set to be substantially equal to the sum of the thickness L,of the margin block,and the thickness L,of the wafer W.