Ayase, Japan

Shinya Iida


Average Co-Inventor Count = 2.7

ph-index = 7

Forward Citations = 134(Granted Patents)


Location History:

  • Ayase-shi, JP (2000)
  • Ayase-shi, Kanagawa-ken, JP (2000 - 2001)
  • Ayase, JP (1999 - 2002)

Company Filing History:


Years Active: 1999-2002

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12 patents (USPTO):

Title: Innovations of Shinya Iida

Introduction

Shinya Iida is a prominent inventor based in Ayase, Japan, known for his significant contributions to the field of semiconductor technology. With a total of 12 patents to his name, Iida has made remarkable advancements in wafer processing techniques.

Latest Patents

Among his latest patents, Iida has developed a wafer flattening process and a storage medium. The wafer flattening process is designed to flatten the entire surface of the wafer, including the outer rim, by inserting dummy data corresponding to the data of the outer rim. This innovative approach allows for precise etching and improved surface quality. Additionally, his wafer etching method incorporates hydrogen gas and ammonia gas to suppress white turbidity during etching, enabling high-quality mirror polishing of the wafer.

Career Highlights

Throughout his career, Iida has worked with various companies, including Speedfam Co., Ltd. His expertise in wafer processing has positioned him as a key figure in the semiconductor industry, contributing to advancements that enhance manufacturing efficiency and product quality.

Collaborations

Iida has collaborated with notable professionals in the field, including Michihiko Yanagisawa and Yasuhiro Horiike. These collaborations have further enriched his work and led to innovative solutions in wafer technology.

Conclusion

Shinya Iida's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative approaches continue to influence the development of advanced wafer processing techniques.

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