The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2002
Filed:
Jan. 21, 1999
Other;
Abstract
A wafer flattening process designed to flatten the entire surface of the wafer including the outer rim of the wafer by inserting dummy data corresponding to the data of the outer rim of the wafer in the data of the outside of the wafer, and a storage medium for the same. An area S is set at an outside position exactly an etching radius r from an outer rim Wc of the wafer Wc ahd the nozzle relative speed at the position-speed data D of points P -1 to P -3 closest to an imaginary line L passing through the point P inside the area S near the outer rim Wc is set to be the same as the nozzle relative speed of the position-speed data D of the point P Due to this, the nozzle spraying the activated species gas G moves as if along the imaginary line L and the portion of the point P is etched flat by superposition of the activated species gas G of the nozzle passing through the points P - to P - the point P and the point P