The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2000

Filed:

Jun. 23, 1998
Applicant:
Inventors:

Shinya Iida, Ayase-shi, Kanagawa-ken, JP;

Akitoshi Yoshida, Ayase-shi, Kanagawa-ken, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ; H01L / ;
U.S. Cl.
CPC ...
210743 ; 210663 ; 210669 ; 210681 ; 210688 ; 210739 ; 210 961 ; 210167 ; 210196 ; 210266 ; 2104161 ; 451 54 ; 451 60 ; 451287 ; 451446 ; 438692 ; 438693 ;
Abstract

A slurry recycling system for a CMP apparatus includes a flow path through which a slurry used in the CMP apparatus flows. A first filter is disposed in the flow path for filtering out foreign matter of a particle size of more than 0.5 microns mixed in said slurry. A second filter is preferably disposed in the flow path at a location upstream of and away from the first filter for filtering out foreign matter of a particle size of more than 10 microns mixed in said slurry. Preferably, provisions are made for a concentration adjuster for adjusting the concentration of abrasives in said slurry to substantially an initial value before use, and a pH adjuster for adjusting the pH of said slurry to substantially an initial pH value before use.


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