The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7094355 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 22, 2006

Filed:

Jul. 22, 2003
Applicants:

Michihiko Yanagisawa, Sagamihara, JP;

Tadayoshi Okuya, Yokohama, JP;

Inventors:

Michihiko Yanagisawa, Sagamihara, JP;

Tadayoshi Okuya, Yokohama, JP;

Assignee:

Speedfam Co., Ltd., Ayase, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B44C 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention provides a local dry etching method comprising the step of removing an oxide film formed on the surface of a semiconductor water before unevenness on the semiconductor wafer is removed by scanning the surface of the semiconductor wafer at a controlled relative speed with a nozzle for applying a flow of activated species gas to the surface of the semiconductor wafer. The removal of this oxide film is carried out by widening an etching profile and a scan pitch and making the nozzle speed constant, and then flattening is carried out in the same local dry etching apparatus. For flattening, the nozzle speed is changed for each area according to initial unevenness.


Find Patent Forward Citations

Yanagisawa, Michihiko. (2006). Local dry etching method (U.S. Patent No. 7094355). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7094355

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