The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2003

Filed:

Jun. 05, 2002
Applicant:
Inventors:

Masami Shiino, Odawara, JP;

Shinji Toda, Fujisawa, JP;

Tomohiro Aizawa, Yokohama, JP;

Tsukasa Taniwaki, Zama, JP;

Assignee:

Speedfam Co., Ltd., Ayase, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract

In the polishing apparatus, the rotating corner polishing member is positioned so that its edge is aligned with the edge of the insulation film, and a pressing means applied the corner polishing member to the metal film of the periphery thereof. The metal film is removed by the rotary driven polishing member and slurry supplied to the polishing area. The metal portion penetrated in the corner formed by the side wall of the insulation film and the surface of the semi-conductor wafer substrate that is extremely difficult to be removed by the conventional removal method, can be removed substantially completely.


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