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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Panjit International Inc.

USPTO Granted Patents = 27

% Expired Patents = 11.1

Trademarks = 2

Forward Citations = 72

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32 inventors (with patents filed for the assignee):

goldMedal Chung-Hsiung Ho (11 out of 11 patents)

silverMedal Chi-Hsueh Li (10 out of 10 patents)

bronzeMedal Tsu Nan Lee (5 out of 7 patents)

4.  Chung-hsiung Ho (4 out of 4 patents)

5.  Jin-Yun Yang (3 out of 3 patents)

6.  Zhong-Lin Tang (3 out of 3 patents)

7.  Lei Zhao (3 out of 3 patents)

8.  Feng Ma (3 out of 3 patents)

9.  Wen-Liang Huang (3 out of 3 patents)

10.  Wei-Ting Chen (2 out of 96 patents)

11.  Yung-Hui Wang (2 out of 11 patents)

12.  Chien-Chun Wang (2 out of 4 patents)

13.  Chih-Hung Chang (2 out of 2 patents)

14.  Chun Kin Patrick Chan (2 out of 2 patents)

15.  Chi-hsueh Li (2 out of 2 patents)


Core Competencies:
Semiconductor Device
Manufacturing Method
Heat Dissipation
Wafer-Level Package
Zener Diode
MOSFET
Heterostructure
Chip-Scale Package
LED Lighting
Micro Bridge Rectifier
Thin Packaging Unit
Composite Pin Structure

27 patents:

1. 12765374 - Semiconductor package with heat-dissipation interface (2026-10-13),
2. 12677449 - Semiconductor device and manufacturing method thereof (2026-07-07),
3. 12641714 - Package capable of eliminating bubble formation (2026-05-26),
4. 12622286 - Side-wettable semiconductor package device with heat dissipation surface structure (2026-05-05),
5. 12610849 - Semiconductor packaging structure (2026-04-21),
6. 12568844 - Wafer-level-package device with peripheral side wall protection (2026-03-03),
7. 12527022 - Heterostructure field effect transistor (HFET) device including controllable dual carrier flow current channel (2026-01-13),
8. 12490519 - Semiconductor device including zener diode ring and manufacturing method of forming the same (2025-12-02),
9. 12490445 - Fabrication method of forming silicon carbide MOSFET (2025-12-02),
10. 12471340 - Manufacturing method of forming semiconductor device and semiconductor device (2025-11-11),
11. 12408407 - Metal oxide semiconductor with multiple drain vias (2025-09-02),
12. 12288737 - Thin semiconductor packaging unit having a plurality of bridging layers (2025-04-29),
13. 12224228 - Packaged component with composite pin structure and manufacturing method thereof (2025-02-11),
14. 12148675 - Power semiconductor package unit of surface mount technology including a plastic film covering a chip (2024-11-19),
15. 11916030 - Method for manufacturing side wettable package (2024-02-27),
Company Overview
Panjit International Inc. is a prominent manufacturer based in Kaohsiung, Taiwan, specializing in semiconductor solutions. The company focuses on the development and production of discrete components, including diodes and transistors, which are essential for various electronic applications. With a commitment to innovation, Panjit serves diverse industries such as consumer electronics, automotive, and telecommunications, leveraging advanced technology to meet the evolving needs of its global clientele.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

27 Patents

#24 in Kaohsiung

#645 in Taiwan

#24,034 in the World

Kaohsiung, TW
Kaohsiung, Taiwan

Panjit International Inc.

Forward Citations = 72

32 inventors:

goldMedal Chung-Hsiung Ho (11 out of 11 patents)

silverMedal Chi-Hsueh Li (10 out of 10 patents)

bronzeMedal Tsu Nan Lee (5 out of 7 patents)

4.  Chung-hsiung Ho (4 out of 4 patents)

5.  Jin-Yun Yang (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Panjit International Inc.. Retrieved from https://idiyas.com/company/panjit-international

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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