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Kaohsiung, Taiwan

Panjit International Inc.

USPTO Granted Patents = 20

Trademarks = 2

Forward Citations = 72

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20 inventors (with patents filed for the assignee):

Chung-Hsiung Ho (11 out of 11 patents)

Chi-Hsueh Li (10 out of 10 patents)

Tsu Nan Lee (5 out of 7 patents)

4. Jin-Yun Yang (3 out of 3 patents)

5. Zhong-Lin Tang (3 out of 3 patents)

6. Lei Zhao (3 out of 3 patents)

7. Feng Ma (3 out of 3 patents)

8. Chih-Hung Chang (2 out of 2 patents)

9. Chun Kin Patrick Chan (2 out of 2 patents)

10. Seungchul Lee (2 out of 2 patents)

11. Yung-Hui Wang (1 out of 10 patents)

12. Chien-Chun Wang (1 out of 3 patents)

13. Tien-Ming Liu (1 out of 1 patent)

14. Youngchul Choi (1 out of 1 patent)

15. Chaohsin Huang (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 12490519 - Semiconductor device including zener diode ring and manufacturing method of forming the same (2025-12-02),

2. 12490445 - Fabrication method of forming silicon carbide MOSFET (2025-12-02),

3. 12471340 - Manufacturing method of forming semiconductor device and semiconductor device (2025-11-11),

4. 12408407 - Metal oxide semiconductor with multiple drain vias (2025-09-02),

5. 12288737 - Thin semiconductor packaging unit having a plurality of bridging layers (2025-04-29),

6. 12224228 - Packaged component with composite pin structure and manufacturing method thereof (2025-02-11),

7. 12148675 - Power semiconductor package unit of surface mount technology including a plastic film covering a chip (2024-11-19),

8. 11916030 - Method for manufacturing side wettable package (2024-02-27),

9. 11848254 - Method for manufacturing a semiconductor package having a conductive pad with an anchor flange (2023-12-19),

10. 11664345 - Semiconductor package element (2023-05-30),

11. 11594425 - Semiconductor package structure and fabricating method of the same (2023-02-28),

12. 11562947 - Semiconductor package having a conductive pad with an anchor flange (2023-01-24),

13. 11387203 - Side wettable package (2022-07-12),

14. 11049781 - Chip-scale package device (2021-06-29),

15. 8875373 - Manufacturing method of a heat conductive device for a light-emitting diode (2014-11-04),

Panjit International Inc. is a leading manufacturer of semiconductor components and electrical devices. With over 30 years of experience in the industry, Panjit specializes in producing diodes, transistors, and other discrete components for a wide range of applications. The company is committed to providing high-quality products and reliable service to customers worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

20 Patents

#31 in Kaohsiung

#795 in Taiwan

#30,316 in the World

Kaohsiung, Taiwan

Panjit International Inc.

Forward Citations = 72

20 inventors:

Chung-Hsiung Ho (11 out of 11 patents)

Chi-Hsueh Li (10 out of 10 patents)

Tsu Nan Lee (5 out of 7 patents)

4. Jin-Yun Yang (3 out of 3 patents)

5. Zhong-Lin Tang (3 out of 3 patents)

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