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Kaohsiung, Taiwan

Panjit International Inc.

USPTO Granted Patents = 26

% Expired Patents = 11.5

Trademarks = 2

Forward Citations = 72

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31 inventors (with patents filed for the assignee):

Chung-Hsiung Ho (11 out of 11 patents)

Chi-Hsueh Li (10 out of 10 patents)

Tsu Nan Lee (5 out of 7 patents)

4. Jin-Yun Yang (3 out of 3 patents)

5. Zhong-Lin Tang (3 out of 3 patents)

6. Lei Zhao (3 out of 3 patents)

7. Feng Ma (3 out of 3 patents)

8. Chung-hsiung Ho (3 out of 3 patents)

9. Wen-Liang Huang (3 out of 3 patents)

10. Yung-Hui Wang (2 out of 11 patents)

11. Chih-Hung Chang (2 out of 2 patents)

12. Chun Kin Patrick Chan (2 out of 2 patents)

13. Chi-hsueh Li (2 out of 2 patents)

14. Seungchul Lee (2 out of 2 patents)

15. Hung Shen Chu (2 out of 2 patents)

Core Competencies:

Semiconductor Device

Manufacturing Method

Heat Dissipation

Wafer-Level Package

Zener Diode

MOSFET

Heterostructure

Chip-Scale Package

LED Lighting

Micro Bridge Rectifier

Thin Packaging Unit

Composite Pin Structure

26 patents: Sort by Forward Citations

1. 12677449 - Semiconductor device and manufacturing method thereof (2026-07-07),

2. 12641714 - Package capable of eliminating bubble formation (2026-05-26),

3. 12622286 - Side-wettable semiconductor package device with heat dissipation surface structure (2026-05-05),

4. 12610849 - Semiconductor packaging structure (2026-04-21),

5. 12568844 - Wafer-level-package device with peripheral side wall protection (2026-03-03),

6. 12527022 - Heterostructure field effect transistor (HFET) device including controllable dual carrier flow current channel (2026-01-13),

7. 12490519 - Semiconductor device including zener diode ring and manufacturing method of forming the same (2025-12-02),

8. 12490445 - Fabrication method of forming silicon carbide MOSFET (2025-12-02),

9. 12471340 - Manufacturing method of forming semiconductor device and semiconductor device (2025-11-11),

10. 12408407 - Metal oxide semiconductor with multiple drain vias (2025-09-02),

11. 12288737 - Thin semiconductor packaging unit having a plurality of bridging layers (2025-04-29),

12. 12224228 - Packaged component with composite pin structure and manufacturing method thereof (2025-02-11),

13. 12148675 - Power semiconductor package unit of surface mount technology including a plastic film covering a chip (2024-11-19),

14. 11916030 - Method for manufacturing side wettable package (2024-02-27),

15. 11848254 - Method for manufacturing a semiconductor package having a conductive pad with an anchor flange (2023-12-19),

Panjit International Inc. is a prominent manufacturer based in Kaohsiung, Taiwan, specializing in semiconductor solutions. The company focuses on the development and production of discrete components, including diodes and transistors, which are essential for various electronic applications. With a commitment to innovation, Panjit serves diverse industries such as consumer electronics, automotive, and telecommunications, leveraging advanced technology to meet the evolving needs of its global clientele.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

26 Patents

#26 in Kaohsiung

#661 in Taiwan

#24,758 in the World

Kaohsiung, Taiwan

Panjit International Inc.

Forward Citations = 72

31 inventors:

Chung-Hsiung Ho (11 out of 11 patents)

Chi-Hsueh Li (10 out of 10 patents)

Tsu Nan Lee (5 out of 7 patents)

4. Jin-Yun Yang (3 out of 3 patents)

5. Zhong-Lin Tang (3 out of 3 patents)

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