The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Apr. 27, 2022
Applicant:

Panjit International Inc., Kaohsiung, TW;

Inventors:

Seungchul Lee, San Jose, CA (US);

Youngchul Choi, Santa Clara, CA (US);

Chaohsin Huang, New Taipei, TW;

Assignee:

PANJIT INTERNATIONAL INC., Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/3213 (2006.01); H10D 12/01 (2025.01); H10D 62/832 (2025.01); H10D 64/01 (2025.01); H10D 30/01 (2025.01);
U.S. Cl.
CPC ...
H10D 12/031 (2025.01); H01L 21/32135 (2013.01); H01L 21/32139 (2013.01); H10D 62/8325 (2025.01); H10D 64/01 (2025.01); H10D 30/0293 (2025.01);
Abstract

A fabrication method of forming a silicon carbide MOSFET is provided. The fabrication method includes the step of providing a semiconductor substrate. A P-well region is formed by implanting the semiconductor substrate through the P-well mask. A spacer is disposed on sidewall of the P-well mask and the P-well region is implanted to form an N-plus layer. A P-plus mask is disposed on the semiconductor substrate and the semiconductor substrate is implanted to form a P-plus layer. A gate oxide layer, a poly gate and a first interlayer dielectric layer are formed on the semiconductor substrate. A second interlayer dielectric layer is disposed on sidewall of the poly gate and the first interlayer dielectric layer. A metal layer is disposed to cover the first interlayer dielectric layer and the second interlayer dielectric layer.


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