The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
May. 03, 2024
Panjit International Inc., Kaohsiung City, TW;
Chung-Hsiung Ho, Kaohsiung City, TW;
Chien-Chun Wang, Tainan City, TW;
Wei-Ting Chen, Taoyuan City, TW;
Wei-Ting Chen, Taipei City, TW;
PANJIT INTERNATIONAL INC., Kaohsiung City, TW;
Abstract
A semiconductor package with a heat dissipation interface has a substrate, at least one die embedded in the substrate, an insulation layer encompassing the die and covering the substrate, an upper redistribution layer (RDL) and a lower RDL respectively formed on opposite sides of the substrate, wherein an insulated adhesive comprehensively covers the lower RDL, and a dissipation layer is further bonded on the insulated adhesive. The dissipation layer evenly dissipates excessive heat energy generated by the die, thereby improving the heat dissipation efficiency.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile