Chien-Chun Wang

Title: Innovations of Chien-Chun Wang

Introduction

Chien-Chun Wang is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving semiconductor packaging and structures, which are crucial for modern electronic devices.

Latest Patents

One of his latest patents is a power semiconductor package unit of surface mount technology that includes a plastic film covering a chip. This invention features a chip, a plastic film layer, and an electroplated layer. The design allows for electrical connections without the need for expensive die bonding materials, enhancing efficiency and reducing costs. Another significant patent is related to a semiconductor structure and the method for forming it. This method involves creating a seed layer over a substrate and utilizing a series of mask layers and conductive materials to form a complex semiconductor structure.

Career Highlights

Chien-Chun Wang has worked with prominent companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and Panjit International Inc. His experience in these organizations has allowed him to develop innovative solutions that address industry challenges.

Collaborations

He has collaborated with notable colleagues such as Wen-Hsiung Lu and Chang-Jung Hsueh, contributing to advancements in semiconductor technology.

Conclusion

Chien-Chun Wang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the development of efficient electronic components.