Tainan, Taiwan

Chi-Hsueh Li


Average Co-Inventor Count = 2.4

ph-index = 1


Company Filing History:


Years Active: 2022-2025

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10 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Chi-Hsueh Li

Introduction

Chi-Hsueh Li, located in Tainan, Taiwan, is a prominent inventor known for his significant contributions to the field of semiconductor technology, holding a total of 9 patents. His inventive prowess has led to advancements that enhance the efficiency and functionality of semiconductor packaging.

Latest Patents

Li's recent patents demonstrate his commitment to innovation in semiconductor applications. One notable patent is the "Thin semiconductor packaging unit having a plurality of bridging layers." This invention comprises a semiconductor die, a mold, two contact bulks, and two insulation layers. The design allows for efficient heat dissipation, which is crucial in maintaining the performance and reliability of semiconductor devices.

Another remarkable patent is the "Packaged component with composite pin structure and manufacturing method thereof." This method involves dividing a substrate into a body area and a pin area, facilitating the creation of a packaged component body and multiple pins without the use of a conventional lead frame. This innovative approach not only streamlines the manufacturing process but also contributes to the integrity of the component.

Career Highlights

Throughout his career, Chi-Hsueh Li has made substantial strides in semiconductor technologies while working at Panjit International Inc. His expertise in semiconductor packaging has played a crucial role in the company's advancements in the industry.

Collaborations

Li has collaborated with esteemed professionals such as Chung-Hsiung Ho and Yung-Hui Wang, combining their skills and knowledge to further innovate in the semiconductor field. This synergy among inventors fosters an environment of creativity and technological advancement.

Conclusion

Chi-Hsueh Li's contributions to the semiconductor industry through his patents reflect his innovative mindset and dedication to improving technology. His work has not only advanced semiconductor packaging methods but also paved the way for future developments in the field.

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