The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Nov. 12, 2020
Applicant:
Panjit International Inc., Kaohsiung, TW;
Inventors:
Chung-Hsiung Ho, Kaohsiung, TW;
Chi-Hsueh Li, Tainan, TW;
Assignee:
PANJIT INTERNATIONAL INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4842 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H01L 23/49582 (2013.01); H01L 23/562 (2013.01);
Abstract
A semiconductor package structure, including a lead frame, a die disposed on the front side of the lead frame, and a molding piece disposed on the lead frame and encapsulates the die, wherein the lead frame is provided with two extension portions extending respectively from two sides of the molding piece, and the extension portion is provided with recessed front surface and back surface on which a plating layer is formed.