The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Sep. 08, 2020
Applicant:
Panjit International Inc., Kaohsiung, TW;
Inventors:
Chung-Hsiung Ho, Kaohsiung, TW;
Chi-Hsueh Li, Tainan, TW;
Assignee:
PANJIT INTERNATIONAL INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/3114 (2013.01); H01L 24/03 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/05557 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/37001 (2013.01);
Abstract
A side wettable package includes a molding compound, a chip and multiple conductive pads exposed from a bottom surface of the molding compound. The conductive pads include peripheral conductive pads arranged near a side wall of the molding compound. Each of the peripheral conductive pads is over etched to form an undercut. When the side wettable package is connected to a circuit board via solder, the solder ascends to the undercut of the peripheral conductive pads for improving connection yield and facilitating inspection of soldering quality.