The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Jul. 05, 2022
Panjit International Inc., Kaohsiung, TW;
Chung-Hsiung Ho, Kaohsiung, TW;
Chi-Hsueh Li, Tainan, TW;
PANJIT INTERNATIONAL INC., Kaohsiung, TW;
Abstract
A thin semiconductor packaging unit includes a semiconductor die, a mold, two contact bulks, a first bridge layer, a second bride layer, and two insulation layers; the mold covers a side surface of the semiconductor die; the mold includes two sides, and each of the sides includes at least one first contact area; the two contact bulks are respectively mounted on the two sides of the mold; each of the contact bulks includes at least one second contact area connecting the at least one first contact area; the first bridge layer connects the top electrode of the semiconductor die to one of the contact bulks; the second bride layer connects the bottom electrode of the semiconductor die to the other one of the contact bulks; the two insulation layers respectively cover the first bridge layer and the second bridge layer; the present invention dissipates heat efficiently.