The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Dec. 22, 2023
Panjit International Inc., Kaohsiung City, TW;
PANJIT INTERNATIONAL INC., Kaohsiung City, TW;
Abstract
A package capable of eliminating bubble formation includes a composite substrate having an accommodating space, an upper conductive layer and a lower conductive layer; at least one conductive via formed in the composite substrate and electrically connected to the upper conductive layer and the lower conductive layer; a die mounted in the accommodating space and having a first surface and a second surface; a molding layer covering the composite substrate and filled in the at least one conductive via and the accommodating space to wrap the die; the support layer buried in the molding layer and located above the upper conductive layer; a redistribution layer mounted on the molding layer and electrically connected to the first surface of the die and the upper conductive layer; wherein the molding layer is formed by laminating a first insulating sheet and a second insulating sheet.