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Kaohsiung, Taiwan

Orient Semiconductor Electronics, Limited

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USPTO Granted Patents = 25

% Expired Patents = 24.0

Trademarks = 1

Forward Citations = 88

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56 inventors (with patents filed for the assignee):

Chia-Ming Yang (7 out of 13 patents)

Hui-Pin Chen (5 out of 5 patents)

Ning Huang (5 out of 5 patents)

4. Chia-Chieh Hu (5 out of 6 patents)

5. Yueh-Ming Tung (4 out of 4 patents)

6. Jung-Wei Chen (3 out of 3 patents)

7. Chia Ming Yang (3 out of 3 patents)

8. Wen-Lo Hsieh (3 out of 5 patents)

9. Chung-Ming Chang (3 out of 4 patents)

10. Wen-Lo Shieh (3 out of 3 patents)

11. Feng-Chang Tu (3 out of 3 patents)

12. Yung-Cheng Chuang (3 out of 3 patents)

13. Fu Yu Huang (3 out of 3 patents)

14. Hua Wen Chiang (3 out of 3 patents)

15. Hsuan Jui Chang (3 out of 3 patents)

Core Competencies:

Heat Spreader

Electromagnetic Shielding

Memory Card

Integrated Circuit

Heat Dissipation

Ball Grid Array

Thin Ball Grid Array

Chip Fabrication

Cooling Arrangement

Underfill Preparation

Lead Frame Structure

Mold Injection

25 patents: Sort by Forward Citations

1. 11462485 - Electronic package including electromagnetic shielding structure and method of manufacture (2022-10-04),

2. 11462454 - Semiconductor package comprising heat spreader and manufacturing method thereof (2022-10-04),

3. 11355356 - Manufacturing method of semiconductor package comprising heat spreader (2022-06-07),

4. 8627577 - Apparatus of checking dimensions of memory card (2014-01-14),

5. D647097 - Memory card (2011-10-18),

6. D647096 - Memory card (2011-10-18),

7. 7948772 - Memory card with electrostatic discharge protection and manufacturing method thereof (2011-05-24),

8. 7576418 - Lead frame structure and applications thereof (2009-08-18),

9. 7394147 - Semiconductor package (2008-07-01),

10. 7115978 - Package Structure (2006-10-03),

11. 6847111 - Semiconductor device with heat-dissipating capability (2005-01-25),

12. 6677185 - Method of affixing a heat sink to a substrate and package thereof (2004-01-13),

13. 6608391 - Preparation method of underfill for flip chip package and the device (2003-08-19),

14. 6600216 - Structure of a pin platform for integrated circuit (2003-07-29),

15. 6577151 - Inspection device for wiring of an integrated circuit (2003-06-10),

Company Overview

Orient Semiconductor Electronics, Limited is a prominent player in the semiconductor industry, specializing in the development and manufacturing of advanced semiconductor solutions. The company focuses on a range of technologies including integrated circuits and power management devices, catering to various sectors such as consumer electronics, automotive, and industrial applications. Headquartered in Kaohsiung, Taiwan, Orient Semiconductor is committed to innovation and quality, positioning itself as a key contributor to the global electronics supply chain.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

25 Patents

#27 in Kaohsiung

#688 in Taiwan

#25,748 in the World

Kaohsiung, Taiwan

Orient Semiconductor Electronics, Limited

Forward Citations = 88

56 inventors:

Chia-Ming Yang (7 out of 13 patents)

Hui-Pin Chen (5 out of 5 patents)

Ning Huang (5 out of 5 patents)

4. Chia-Chieh Hu (5 out of 6 patents)

5. Yueh-Ming Tung (4 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Orient Semiconductor Electronics, Limited. Retrieved from https://idiyas.com/company/orient-semiconductor-electronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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